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LM2904DR is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists UMW. Its product description is SOP-8 OPAMP ROHS. Review the specifications below when checking this part for your BOM.
The UMW LM2904DR is a dual operational amplifier housed in an SOP-8 package. It operates from a single power supply ranging from 3V to 26V or dual supplies of ±1.5V to ±13V. The device features two internally compensated amplifiers with a typical supply current of 0.7mA at 5V and up to 1.2mA at 30V. Key electrical parameters include an input offset voltage of 7mV, input bias current of 40nA to 300nA, and a large signal voltage gain of 25V/mV. The output can source up to 20mA and sink up to 8mA. It supports a working temperature range of -25°C to 85°C.
Verify the specific manufacturer designation as UMW when sourcing this component. Confirm the SOP-8 package type matches the design requirements. Ensure the operating temperature range of -25°C to 85°C aligns with the application environment. Cross-reference the absolute maximum ratings, particularly the differential input voltage limit of 26V, to prevent damage during system integration.
Select the LM2904DR for applications requiring dual amplification within a compact SOP-8 footprint. It is suitable for designs needing low power consumption and wide supply voltage flexibility. Consider its internal frequency compensation for stable performance in unity gain configurations. Verify that the input common-mode voltage range includes ground if sensing near zero volts is required.
The LM2904 series consists of dual operational amplifiers designed for general-purpose analog signal processing. Manufactured by UMW, this variant utilizes surface-mount technology via the SOP-8 package. It serves as a cost-effective solution for industrial and commercial electronics where space constraints and power efficiency are critical design factors.
Check pinout compatibility with existing designs. Verify that replacement components meet the same supply voltage and current specifications. Ensure the thermal characteristics and package dimensions match the PCB layout constraints.
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