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LMH6551MM/NOPB is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP VFB 1 CIRCUIT 8VSSOP. Review the specifications below when checking this part for your BOM.
The LMH6551MM/NOPB is a single-channel, high-speed voltage feedback operational amplifier manufactured by Texas Instruments. It features a gain-bandwidth product of 370 MHz and a slew rate of 2.4 kV/µs. The device operates on a supply voltage range of 3 V to 12 V with an operating supply current of 11.5 mA. Key electrical parameters include an input offset voltage of 4 mV, input bias current of 4 µA, common-mode rejection ratio of 78 dB, and input voltage noise density of 6 nV/√Hz. It provides an output current of 60 mA per channel and is housed in an 8-pin VSSOP package.
Verify the specific suffix MM against the official datasheet to confirm the VSSOP-8 package type and temperature range. Ensure the NOPB designation confirms RoHS compliance and absence of lead-based materials as per manufacturer standards. Cross-reference the manufacturer part number with authorized distributors to validate authenticity and traceability before procurement.
Select this component when a single-channel differential output is required alongside moderate bandwidth needs around 370 MHz. Consider the 11.5 mA supply current for power-sensitive designs compared to higher consumption alternatives. Evaluate the VSSOP-8 footprint constraints against available PCB real estate and thermal dissipation requirements for surface-mount assembly.
This device belongs to the LMH6551 family of high-speed operational amplifiers designed for video and broadband applications. It serves as a differential output variant within the series, offering balanced signal handling capabilities. The component is engineered to maintain signal integrity in high-frequency environments while providing robust drive strength for downstream stages.
LMH6551MAX/NOPB is a direct pin-compatible alternative featuring an 8-SOIC package instead of VSSOP. Verify package dimensions and thermal characteristics before substitution to ensure mechanical fit within the existing design constraints.
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