LRPS-3-1+

RF Power Dividers/Splitters Overview

The LRPS-3-1+ is a three-way core and wire power splitter manufactured by Mini-Circuits. It operates within a frequency range of 10 MHz to 300 MHz and features a 50-ohm impedance. Key electrical specifications include a minimum isolation of 20 dB and a maximum imbalance of 4 degrees. The component utilizes an SMD flat lead package with dimensions of 7.87 mm in length and 5.38 mm in height, designed for surface-mount integration.

RF Power Dividers/Splitters Feature Summary

• Three-way signal distribution capability
• Core and wire construction technology
• Surface-mount flat lead packaging

RF Power Dividers/Splitters Applications

• RF signal distribution networks
• Antenna array feeding systems
• Test and measurement equipment

RF Power Dividers/Splitters Procurement Notes

Verify the specific part number suffix against official Mini-Circuits documentation to ensure correct configuration. Confirm that the operating frequency range aligns with system requirements. Check package compatibility for surface-mount assembly processes. Validate isolation and imbalance specifications against design constraints before procurement.

RF Power Dividers/Splitters Selection Notes

Select this component when a three-way split is required within the 10 MHz to 300 MHz band. Consider the core and wire construction for robust performance. Evaluate the physical footprint against board space limitations. Ensure the 50-ohm impedance matches the surrounding circuit architecture.

RF Power Dividers/Splitters Part Context

This device belongs to the Mini-Circuits RF power divider and splitter family. It provides passive signal splitting functionality without active amplification. The product line emphasizes reliable performance in radio frequency applications through standardized manufacturing processes.

RF Power Dividers/Splitters Replacement Considerations

Consult Mini-Circuits official substitution guides for compatible alternatives. Verify that any replacement maintains identical frequency ranges and impedance values. Ensure physical package dimensions allow for direct or adapted mounting.