Microprocessors LX2122RC82029B product image

LX2122RC82029B

$308.30
  • Description:IC MPU QORIQ LX 2GHZ 1150FBGA
  • Series:QorIQ LX
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:26ab64dd1949 Category: Brand:

  
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LX2122RC82029B is listed in the Microprocessors range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MPU QORIQ LX 2GHZ 1150FBGA. Review the specifications below when checking this part for your BOM.

Microprocessors specifications for LX2122RC82029B

  • Description:IC MPU QORIQ LX 2GHZ 1150FBGA
  • Series:QorIQ LX
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:ARM® Cortex®-A72
  • Number of Cores/Bus Width:12 Core, 64-Bit
  • Speed:2GHz
  • Co-Processors/DSP:-
  • RAM Controllers:DDR4, SDRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:SATA 6Gbps (4)
  • USB:USB 3.0 (1)
  • Voltage - I/O:-
  • Operating Temperature:5°C ~ 105°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:1150-FBGA
  • Supplier Device Package:1150-FBGA (23x23)
  • Additional Interfaces:CANbus, I2C, PCIe, SPI, UART

Microprocessors datasheet and documents for LX2122RC82029B

LX2122RC82029B

Microprocessors Overview

The LX2122RC82029B is a QorIQ LX series microprocessor featuring twelve ARM Cortex-A72 cores operating at 2.0 GHz. It utilizes a 64-bit architecture within a 23x23 mm, 1150-pin FBGA package. The device supports DDR4 memory controllers and includes integrated security features. Connectivity options encompass Ethernet, PCIe, USB 3.0, I2C, and CAN-FD interfaces. It operates within a temperature range of 5°C to 105°C.

Microprocessors Feature Summary

  • Twelve-core ARM Cortex-A72 processor architecture for high-performance computing
  • Integrated hardware security acceleration capabilities
  • Support for multiple high-speed peripheral interfaces including PCIe and USB 3.0

Microprocessors Applications

  • Industrial automation controllers
  • Telecommunications infrastructure equipment
  • Enterprise networking gateways

Microprocessors Procurement Notes

Verify the specific revision level (Rev2) and indoor specification requirements against your design needs. Confirm that the 1150-FBGA package footprint matches your PCB layout constraints. Ensure thermal management solutions accommodate the 2.0 GHz processing load within the specified operating temperature range.

Microprocessors Selection Notes

Select this component when twelve dedicated application cores are required alongside robust connectivity options. The inclusion of CAN-FD makes it suitable for industrial environments requiring deterministic communication. Consider the 23x23 mm package size during mechanical design phases to ensure adequate board space allocation.

Microprocessors Part Context

This part belongs to the NXP QorIQ LX family, designed for cost-effective yet powerful embedded applications. It shares architectural similarities with higher-end LX21xx models but offers a reduced core count. The LX series targets markets needing balanced performance and power efficiency without the complexity of larger server-grade processors.

Microprocessors Replacement Considerations

Direct substitutes include other LX2122 variants with different suffixes indicating packaging or temperature variations. Cross-family migration to LX2080 requires significant software adaptation due to core count differences. Verify pin compatibility before considering alternative packages within the same product line.

LX2122RC82029BLX2122RC82029B
$308.30
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