M22-5431105

Headers, Male Pins Overview

The M22-5431105 is a pin header from the Harwin M22 series, designed for board-to-board connections. It features a 2 mm pitch and utilizes phosphor bronze contacts with gold plating. The component employs a thermoplastic housing capable of withstanding reflow soldering processes. It supports through-hole mounting and offers design flexibility through multiple configuration options and pin mating lengths.

Headers, Male Pins Feature Summary

• High temperature thermoplastic housings withstand reflow soldering
• Multiple configuration options available for design flexibility
• Various pin mating lengths supported

Headers, Male Pins Applications

• Board-to-board interconnections
• Through-hole PCB assembly
• Reflow soldering compatible circuits

Headers, Male Pins Procurement Notes

Verify the specific contact count and orientation against official datasheets, as the M22 series includes various configurations. Confirm that the gold-plated phosphor bronze contacts meet the required electrical specifications for the target application. Ensure the through-hole mounting style aligns with the PCB layout requirements.

Headers, Male Pins Selection Notes

Select this component when a robust, high-temperature connector is needed for board-to-board applications. The M22 series provides flexibility in pin counts and orientations. Verify that the 2 mm pitch fits the design constraints and that the through-hole termination method is suitable for the manufacturing process.

Headers, Male Pins Part Context

This part belongs to the Harwin M22 series, which is characterized by its use of high-temperature thermoplastics and flexible design options. The series is widely used in applications requiring reliable board-to-board connections with through-hole mounting capabilities.

Headers, Male Pins Replacement Considerations

Consult the official Harwin catalog for alternative M22 series variants with different pin counts or orientations. No direct substitute part numbers are publicly confirmed.