Soc System On Chip M2S005S-WAFERLOT product image

M2S005S-WAFERLOT

  • Description:M2S005S-WAFERLOT
  • Series:SmartFusion®2

SKU:b361f6b3db47 Category: Brand:

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M2S005S-WAFERLOT is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is M2S005S-WAFERLOT. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for M2S005S-WAFERLOT

  • Description:M2S005S-WAFERLOT
  • Series:SmartFusion®2
  • Mfr:Microchip Technology
  • Package:Bulk
  • Architecture:MCU, FPGA
  • Core Processor:ARM® Cortex®-M3
  • Flash Size:128KB
  • RAM Size:64KB
  • Peripherals:DDR, PCIe, SERDES
  • Connectivity:CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Speed:166MHz
  • Primary Attributes:FPGA - 5K Logic Modules
  • Operating Temperature:-
  • Grade:-
  • Qualification:-
  • Package / Case:Die
  • Supplier Device Package:Die

Soc System On Chip datasheet and documents for M2S005S-WAFERLOT

M2S005S-WAFERLOT

Soc System On Chip Overview

The M2S005S-WAFERLOT is a System on Chip (SoC) die from Microchip Technology, belonging to the SmartFusion2 series. It integrates an ARM Cortex-M3 processor with FPGA fabric. The component operates at a maximum clock frequency of 166MHz and contains approximately 5K logic modules. This wafer lot format provides bare silicon dies for custom packaging or advanced substrate integration.

Soc System On Chip Feature Summary

  • Integrates ARM Cortex-M3 MCU core with configurable FPGA logic
  • Provides bare die configuration for custom assembly
  • Supports high-speed embedded applications via SoC architecture

Soc System On Chip Applications

  • Custom system-in-package implementations
  • Advanced substrate-level integration projects
  • Specialized industrial control systems requiring form-factor flexibility

Soc System On Chip Procurement Notes

Verify that your manufacturing process supports bare die handling and wire bonding or flip-chip assembly. Confirm compatibility with your chosen substrate material and thermal management strategy. Ensure compliance with export regulations as this item may require additional documentation for international shipping. Consult Microchip for specific wafer lot availability and quality certifications.

Soc System On Chip Selection Notes

Select this component when standard package options do not meet size, weight, or performance requirements. Ideal for designers needing to integrate the SmartFusion2 architecture into proprietary packages. Evaluate thermal dissipation capabilities early in the design phase due to the exposed die nature. Compare against packaged variants like FGG484 if standard mounting is sufficient.

Soc System On Chip Part Context

This part belongs to the SmartFusion2 family, which combines flash-based FPGA technology with an ARM Cortex-M3 processor. Unlike packaged ICs, the WAFERLOT designation indicates raw silicon wafers or individual dies. It serves as a foundational component for manufacturers creating custom hybrid integrated circuits or specialized modules within the Microchip ecosystem.

M2S005S-WAFERLOTM2S005S-WAFERLOT

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