M2S050TS-FGG896

Soc System On Chip Overview

The M2S050TS-FGG896 is a SmartFusion® 2 System-on-Chip FPGA from Microchip Technology, featuring an ARM Cortex-M3 processor and 56,340 logic elements. It integrates hard DDR3 memory controllers with error correction, up to four PCI Express Gen 2 endpoints, and high-speed SerDes interfaces. The device utilizes low-power flash technology for non-volatile configuration. Electrical specifications include a core supply voltage (VDD) of 1.14V to 1.26V and I/O bank voltages ranging from 1.14V to 3.3V. It operates within junction temperatures of -40°C to 100°C for industrial grades.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-M3 microcontroller subsystem with rich peripherals including Ethernet, USB, and CAN.
• Features 56,340 Logic Elements and up to 5 MBs of embedded RAM with hard DDR3 controllers.
• Supports high-speed communication via up to 16 SerDes lanes and four PCIe Gen 2 endpoints.
• Utilizes industry-leading low-power flash technology for secure and reliable non-volatile configuration.

Soc System On Chip Applications

• Industrial automation and control systems requiring real-time processing.
• Telecommunications infrastructure utilizing high-speed serial interfaces.
• Secure embedded applications leveraging integrated cryptographic blocks and data security features.
• Test and measurement equipment requiring mixed-signal processing capabilities.

Soc System On Chip Procurement Notes

Verify the specific temperature grade and speed bin required for the application environment. Confirm that the 896-pin FBGA package fits the board layout constraints. Check for any relevant Product Change Notices (PCNs) regarding assembly or material changes. Ensure compliance with RoHS and REACH regulations as specified in the datasheet. Validate power supply sequencing requirements for VDD, VPP, and I/O banks during programming and operation.

Soc System On Chip Selection Notes

Select this model when both FPGA fabric flexibility and MCU integration are needed. Compare against IGLOO 2 devices if only FPGA functionality is required without the MSS. Consider thermal resistance values (θJA, θJB) for heat dissipation planning. Verify that the available I/O count meets interface requirements. Ensure the design toolchain supports the specific speed grade and temperature range selected.

Soc System On Chip Part Context

This part belongs to the SmartFusion 2 family, which combines FPGA fabric with a hardened ARM Cortex-M3 subsystem. It shares architectural similarities with IGLOO 2 FPGAs but adds significant processing and connectivity resources. The 'TS' suffix indicates a specific density and security level within the 050-class devices. It competes in the mid-density SoC FPGA market for secure, low-power applications.

Soc System On Chip Replacement Considerations

Direct replacements may include other SmartFusion 2 variants with different pin counts or densities, such as M2S050T-FG896. Cross-family migration to IGLOO 2 requires removing MSS dependencies. Always verify pin compatibility and resource availability before substituting. Consult Microchip for current lifecycle status and end-of-life notifications.