M2S060TS-1FCSG325I

Soc System On Chip Overview

The M2S060TS-1FCSG325I is a SmartFusion® 2 System-on-Chip FPGA featuring an ARM Cortex-M3 microcontroller subsystem and a 56.5K logic element fabric. It operates within an industrial temperature range of -40°C to 100°C junction temperature. The device utilizes a 325-pin Fine Pitch Ball Grid Array (FCSG) package with dimensions of 11mm x 11mm. Key electrical specifications include a core supply voltage (VDD) of 1.2V nominal, with I/O banks supporting voltages from 1.2V to 3.3V. The architecture integrates embedded flash memory, SRAM, and high-speed serial interfaces on a single chip.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-M3 processor with up to 56.5K FPGA logic elements
• Industrial temperature grade (-40°C to 100°C TJ)
• 325-ball FCBGA package (11mm x 11mm footprint)
• Supports multiple I/O standards including LVDS, LVCMOS, and DDR

Soc System On Chip Applications

• Industrial automation controllers requiring real-time processing
• Secure IoT gateways utilizing embedded flash technology
• Automotive infotainment systems meeting AEC-Q100 standards
• Medical imaging equipment requiring low-power operation

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature rating (-40°C to 100°C). Confirm the package type is FCSG325 (11x11mm). Check for RoHS compliance status in the latest datasheet revision. Ensure ESD handling procedures are followed during assembly.

Soc System On Chip Selection Notes

Select this model when industrial temperature stability is required alongside mixed-signal capabilities. Compare logic density requirements against the 56.5K LE limit. Verify power supply constraints match the 1.2V core and variable I/O voltage needs. Consider thermal resistance values for heat dissipation planning.

Soc System On Chip Part Context

This component belongs to the SmartFusion® 2 family, bridging MCU and FPGA technologies. It succeeds earlier Microsemi SoC FPGAs. The 'TS' designation indicates data security features. It competes in the low-to-mid density secure FPGA market segment.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements may exist within the same SmartFusion 2 series with different densities (e.g., M2S050TS or M2S090TS). Verify functional equivalence for the Cortex-M3 subsystem and peripheral counts before substitution.