Soc System On Chip M2S060TS-FCSG325I product image

M2S060TS-FCSG325I

$119.02
  • Description:IC SOC CORTEX-M3 166MHZ 325BGA
  • Series:SmartFusion®2

SKU:b4d3134b0c82 Category: Brand:

  
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M2S060TS-FCSG325I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 325BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for M2S060TS-FCSG325I

  • Description:IC SOC CORTEX-M3 166MHZ 325BGA
  • Series:SmartFusion®2
  • Mfr:Microchip Technology
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:ARM® Cortex®-M3
  • Flash Size:256KB
  • RAM Size:64KB
  • Peripherals:DDR, PCIe, SERDES
  • Connectivity:CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Speed:166MHz
  • Primary Attributes:FPGA - 60K Logic Modules
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:325-TFBGA, FCBGA
  • Supplier Device Package:325-FCBGA (11x11)

Soc System On Chip datasheet and documents for M2S060TS-FCSG325I

M2S060TS-FCSG325I

Soc System On Chip Overview

The M2S060TS-FCSG325I is a SmartFusion® 2 System-on-Chip FPGA from Microchip Technology, featuring an ARM® Cortex®-M3 microcontroller subsystem integrated with a 4-input LookUp Table (LUT) based FPGA fabric. It provides 56,520 logic cells and supports industrial operating temperatures ranging from -40°C to 100°C. The device includes embedded memory blocks, high-performance SerDes interfaces, and hard DDR3 controllers. Key electrical specifications include a DC core supply voltage (VDD) of 1.14V to 1.26V and I/O buffer supplies (VDDIx) configurable for standards such as LVCMOS 3.3V, LVCMOS 2.5V, and LVDS.

Soc System On Chip Feature Summary

  • Integrated ARM® Cortex®-M3 Microcontroller Subsystem (MSS) with real-time processing capabilities
  • 56,520 Logic Elements (LEs) within the low-power flash-based FPGA fabric
  • Industrial temperature grade supporting junction temperatures from -40°C to 100°C
  • High-speed communication interfaces including up to four PCI Express Gen 2 endpoints and multiple SerDes lanes

Soc System On Chip Applications

  • Industrial automation and control systems requiring secure, low-power processing
  • Automotive electronics utilizing CANbus and Ethernet connectivity
  • Secure infrastructure equipment leveraging embedded nonvolatile memory (eNVM)
  • Test and measurement instruments requiring high-density programmable logic

Soc System On Chip Procurement Notes

Verify that the ordering suffix 'I' corresponds to the Industrial temperature range (-40°C to 100°C). Confirm the package designation FCSG325 matches the required 325-ball Fine-pitch Ball Grid Array (FBGA) footprint. Ensure design tools are configured for the specific speed grade associated with the part number prefix M2S060TS.

Soc System On Chip Selection Notes

Select this component when both MCU and FPGA functionality are required in a single die. The Industrial grade is necessary for environments exceeding commercial limits. Verify power supply requirements for VPP (2.5V or 3.3V range) and ensure adequate thermal management, as the junction-to-ambient resistance varies with airflow conditions.

Soc System On Chip Part Context

This device belongs to the SmartFusion® 2 family, which combines flash-based FPGA technology with an integrated microcontroller. It shares the same FPGA fabric architecture as the IGLOO® 2 series but adds the MSS. The 'TS' designation indicates the specific density and feature set within the 060-class devices, distinguishing it from standard M2S060 variants.

Soc System On Chip Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Cross-referencing should be performed using the SmartTime timing model and physical pinout compatibility with existing designs.

M2S060TS-FCSG325IM2S060TS-FCSG325I
$119.02
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