M2S060TS-WAFERLOT

Soc System On Chip Overview

The M2S060TS-WAFERLOT is a SmartFusion2 System-on-Chip (SoC) FPGA wafer lot from Microchip Technology. It integrates an ARM Cortex-M3 processor with 60K logic modules and operates at a maximum clock frequency of 166 MHz. The device features 256 KB of program memory and includes embedded Flash for non-volatile storage. Designed for high reliability, it supports advanced security requirements and low-power applications within the SmartFusion2 family.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-M3 processor with 60K logic modules
• Operates at up to 166 MHz clock speed
• Includes embedded Flash for secure non-volatile storage
• Designed for high-reliability and low-power SoC applications

Soc System On Chip Applications

• Industrial control systems requiring high reliability
• Automotive electronics with strict safety standards
• Aerospace and defense embedded processing
• Secure IoT edge devices
• Medical instrumentation requiring low power consumption

Soc System On Chip Procurement Notes

Verify wafer lot availability directly with Microchip or authorized distributors. Confirm export compliance documentation as this product may require additional files for US export. Ensure design-in compatibility with SmartFusion2 development tools. Check for obsolescence status as wafer lots are specialized inventory items.

Soc System On Chip Selection Notes

Select this wafer lot only if custom silicon configuration is required. Standard packaged versions like M2S060TS-1VFG400T2 offer easier integration. Evaluate long-term supply stability for wafer-based procurement. Confirm toolchain support for SmartFusion2 architecture before committing to wafer-level sourcing.

Soc System On Chip Part Context

Part of the SmartFusion2 family combining FPGA fabric with ARM Cortex-M3. Targets markets needing deterministic real-time control alongside programmable logic. Provides hardware security features including tamper detection. Enables system-level integration reducing component count in complex designs.

Soc System On Chip Replacement Considerations

Consider M2S060TS-1VFG400T2 for packaged equivalent functionality. Verify pinout and thermal compatibility when substituting wafer lots with finished packages. Assess tooling costs for wafer handling versus standard BGA components.