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M2S090T-FCSG325I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 325BGA. Review the specifications below when checking this part for your BOM.
The M2S090T-FCSG325I is a SmartFusion® 2 System-on-Chip FPGA from Microchip Technology, featuring an ARM Cortex-M3 processor and 90K logic elements. It operates within a junction temperature range of -40°C to 100°C (Industrial) or 0°C to 85°C (Commercial). The device utilizes a 325-FCBGA package with dimensions of 11x13.5 mm. Key electrical parameters include a core supply voltage (VDD) of 1.14V to 1.26V and I/O supply voltages ranging from 1.14V to 3.3V depending on the bank configuration.
Verify the specific speed grade suffix (-1) and temperature grade (Industrial 'I') against the required design specifications. Confirm the package type is FCBGA-325. Ensure that the ordering documentation matches the exact part number M2S090T-FCSG325I to avoid compatibility issues with firmware or hardware designs.
Select this model when a combination of FPGA fabric and embedded processing is required. The Industrial temperature rating (-40°C to 100°C) makes it suitable for harsh environments. Consider the 90K LE density and available I/O banks for interface requirements. Verify thermal management needs based on the junction-to-air thermal resistance values provided in the datasheet.
This component belongs to the SmartFusion® 2 family, which combines flash-based FPGA technology with an embedded ARM Cortex-M3 processor. It is designed for applications requiring high security, low power, and instant-on capabilities. The 'T' suffix indicates a specific variant within the 090 density class, while 'I' denotes the industrial temperature range.
Direct replacements within the same family include other M2S090 variants with different packages or speed grades, such as M2S090TS-FCSG325I. Cross-family migration to IGLOO 2 FPGAs requires re-evaluation of the embedded processor requirements.
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