MASW-007073-000100

RF Switches Overview

The MASW-007073-000100 is a GaAs MMIC absorptive SP4T switch featuring an integral silicon ASIC driver. It is housed in a 24-lead plastic package. The device integrates the switching element and control logic into a single compact component, designed for high-performance RF signal routing applications requiring low insertion loss and high isolation characteristics typical of absorptive topologies.

RF Switches Feature Summary

• Integrates GaAs MMIC absorptive SP4T switch with silicon ASIC driver
• Utilizes 24-lead plastic package for compact integration

RF Switches Applications

• RF signal routing systems
• Telecommunications infrastructure
• Test and measurement equipment

RF Switches Procurement Notes

Verify the specific datasheet version and manufacturer documentation to confirm pinout compatibility and electrical specifications before integration. Ensure that the supply chain source provides authentic components from MACOM Technology Solutions to guarantee performance reliability and adherence to technical standards.

RF Switches Selection Notes

Select this component when an integrated solution combining RF switching and digital control is required within a limited footprint. The absorptive architecture offers distinct advantages in return loss compared to reflective switches. Evaluate system requirements against the specific GaAs MMIC capabilities and the integrated ASIC driver functionality.

RF Switches Part Context

This part belongs to the MASW series of RF switch ICs manufactured by MACOM Technology Solutions. These components are engineered for radio frequency applications, utilizing Gallium Arsenide (GaAs) Monolithic Microwave Integrated Circuit technology to achieve high linearity and low noise figures in compact form factors suitable for modern electronic systems.

RF Switches Replacement Considerations

Consult official MACOM documentation for direct cross-reference or alternative part numbers within the same product family. Verify functional equivalence regarding package dimensions, pin configuration, and electrical parameters before substituting.