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MAX149BEAP+T is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC ADC 10BIT SAR 20SSOP. Review the specifications below when checking this part for your BOM.
The MAX149BEAP+T is a low-power, 8-channel, serial 10-bit analog-to-digital converter (ADC) from Analog Devices. It operates on a single +2.7V to +5.25V supply and samples at up to 133ksps. The device integrates an internal 2.5V reference and features software-configurable unipolar/bipolar and single-ended/differential inputs. It utilizes a 4-wire serial interface compatible with SPI/QSPI/MICROWIRE/TMS320 protocols. Key electrical parameters include ±1 LSB INL, ±1 LSB DNL, and a typical operating current of 1.2mA at 133ksps. It is housed in a 20-pin SSOP package.
Verify the specific suffix 'E' indicates the extended temperature range (-40°C to +85°C). Confirm the '+T' designation corresponds to tape-and-reel packaging. Ensure the component matches the lead-free/RoHS-compliant specification indicated by the '+' symbol. Cross-reference the manufacturer's ordering information for availability status.
Select this component when an 8-channel multiplexed ADC is required with low power consumption. Choose the MAX149 variant over the MAX148 if an integrated internal reference is preferred. Ensure the application supports the 10-bit resolution and 133ksps sampling rate. Verify that the serial interface timing aligns with the host microcontroller's capabilities.
This part belongs to the MAX148/MAX149 family of low-power serial ADCs. It shares architectural similarities with the MAX1248/MAX1249 but offers eight channels instead of four. The device is designed for battery-operated applications requiring moderate speed and resolution. It complements other Maxim Integrated data acquisition solutions.
The MAX148AEAP+T serves as a functional substitute but requires an external voltage reference. The MAX149AEP+T is available in a PDIP package. Verify pinout compatibility and thermal performance differences between SSOP and alternative packages before substitution.
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