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MBR1545CT-Y is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE ARRAY GP 45V 15A TO-220AB. Review the specifications below when checking this part for your BOM.
The MBR1545CT-Y is a dual common cathode Schottky rectifier manufactured by Taiwan Semiconductor Corporation. It features a 45 V repetitive peak reverse voltage and a combined average forward current of 15 A. The device utilizes silicon technology in a D2PAK surface-mount package. Key electrical characteristics include a maximum forward voltage of 840 mV at 15 A, a surge current rating of 150 A, and a maximum reverse leakage current of 100 µA. It operates within a temperature range of -65 °C to +175 °C.
Verify the specific suffix 'Y' against the official Taiwan Semiconductor datasheet to confirm it denotes the D2PAK package and automotive qualification status. Ensure the ordering part number matches the exact mechanical dimensions and thermal characteristics required for the target PCB layout. Cross-reference the RoHS and REACH compliance details provided in the manufacturer's documentation prior to final procurement.
Select this component for designs requiring low forward voltage and fast recovery in compact surface-mount layouts. The D2PAK package offers improved thermal performance compared to traditional through-hole options. Verify that the 45 V reverse voltage rating provides sufficient margin for the specific circuit's peak inverse voltage requirements under all operating conditions.
This device belongs to the Power Schottky Rectifier series from Taiwan Semiconductor. It is designed as an alternative to standard rectifiers where efficiency and speed are critical. The dual common cathode arrangement allows for use in full-wave rectification or synchronous rectification topologies without requiring discrete diode pairs.
Check for direct substitutes such as the STPS1545C-Y which shares similar electrical ratings and automotive qualification. Verify pinout compatibility and thermal resistance values before substituting to ensure the new component fits the existing thermal management design.
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