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MC74ACT541DTG is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC BUFF NON-INVERT 5.5V 20TSSOP. Review the specifications below when checking this part for your BOM.
The MC74ACT541DTG is an octal buffer and line driver from the 74ACT logic series, manufactured by onsemi. It features non-inverting outputs with three-state capability, housed in a 20-pin TSSOP package. The device operates within a supply voltage range of 4.5 V to 5.5 V. Key electrical parameters include a propagation delay of 7.5 ns at 5 V, high-level output current of -24 mA, and low-level output current of 24 mA. Static current is specified at 8 uA, with a maximum power dissipation of 200 mW. It supports industrial operating temperatures from -40°C to +85°C.
Verify the specific suffix 'DTG' confirms the TSSOP-20 package and lead-free RoHS compliance as documented in the official datasheet. Ensure the order matches the exact part number to avoid confusion with tape-and-reel variants like DTR2G or different package types such as SOIC. Confirm manufacturer origin is onsemi for guaranteed specification adherence.
Select this component when high-speed buffering with strong drive capability (24 mA) is required for 5V systems. The ACT series offers faster performance than standard AC/HC families while maintaining CMOS compatibility. The through-package design is critical for applications requiring compact routing between processor pins and peripheral buses.
This device belongs to the MC74ACT541 family of octal buffers. It serves as the non-inverting counterpart to the MC74AC540. Functionally similar to the MC74AC244 but distinguished by its through-package pinout, it is optimized for high-density digital logic applications requiring reliable signal integrity and bus isolation.
MC74ACT541DTR2G: Same logical function and specifications, differing only in tape-and-reel packaging instead of tube.
The inputs are TTL-compatible, allowing direct connection to TTL logic levels without external interface components.
The through architecture positions inputs and outputs on opposite sides of the 20-TSSOP package, simplifying trace routing and increasing PCB density.
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