— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU I.MX6DL 1GHZ 624MAPBGA
- Series:i.MX6DL
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:ARM® Cortex®-A9
- Number of Cores/Bus Width:2 Core, 32-Bit
- Speed:1GHz
- Co-Processors/DSP:Multimedia; NEON™ SIMD
- RAM Controllers:LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:Yes
- Display & Interface Controllers:Keypad, LCD
- Ethernet:10/100/1000Mbps (1)
- SATA:-
- USB:USB 2.0 + PHY (4)
- Voltage - I/O:1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:-40°C ~ 125°C (TJ)
- Security Features:ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:624-LFBGA
- Supplier Device Package:624-MAPBGA (21x21)
- Additional Interfaces:CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
- Grade:-
- Qualification:-
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Overview
The MCIMX6U1AVM10AC is an i.MX 6DualLite automotive processor featuring dual Arm Cortex-A9 cores operating at 1 GHz. It utilizes a 21x21 mm MAPBGA package with 0.8 mm pitch. The device supports DDR3, DDR3L, and LPDDR2-800 memory interfaces. Key hardware includes MLB for MOST networks, but excludes VPU and GPU accelerators. It integrates security modules such as CAAM and HAB v4, along with standard connectivity including USB, Ethernet, and CAN.
Feature Summary
- Dual-core Arm Cortex-A9 MPCore platform with TrustZone support
- Integrated MediaLB interface for MOST network connectivity
- Hardware-accelerated security features including CAAM and Advanced High Assurance Boot
- Comprehensive multimedia and peripheral interface suite
Applications
- Automotive navigation and entertainment systems
- Telematics control units
- Human Machine Interface (HMI) graphics rendering
- Display-based instrument clusters
Procurement Notes
Verify the specific silicon revision suffix against current NXP documentation to ensure compatibility with required firmware and errata levels. Confirm that the automotive temperature grade (-40°C to +125°C) aligns with your system's thermal design constraints. Cross-reference the part number nomenclature to ensure the absence of VPU and GPU blocks matches your application's processing requirements.
Selection Notes
Select this component when dual-core processing power is required alongside dedicated media bus connectivity for audio/video streams via MOST. The exclusion of video and 3D graphics hardware makes it suitable for applications where these tasks are offloaded or unnecessary. Ensure the design accommodates the 21x21 mm BGA footprint and supports the necessary DDR3/LPDDR2 memory configurations for optimal performance.
Part Context
This part belongs to the i.MX 6Solo/6DualLite family, specifically tailored for automotive and infotainment markets. It shares the core architecture with consumer variants but adheres to stricter automotive reliability and temperature standards. The 'U' designation indicates the DualLite configuration, while '1' specifies the feature set excluding video and graphics processors.
Replacement Considerations
MCIMX6U1AVM08AC: Same package and core count but operates at 800 MHz speed grade. MCIMX6U6AVM10AC: Dual Lite variant with integrated Video Processing Unit and Graphics Processing Unit.
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