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MK 14 X 3 11 Z is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is Solder and plug pins, D0.5 mm. Review the specifications below when checking this part for your BOM.
The MK 14 X 3 11 Z is a male pin header connector from the Fischer Elektronik MK 14 X 3 series. It features a single row with 11 positions and a 2.54 mm (0.100 inch) pitch spacing. Designed for through-hole mounting, this board-to-board or wire-to-board connector utilizes a CuZn-alloy contact material. The contacts are finished with a nickel underplate and gold plating of at least 0.2 micrometers to ensure reliable electrical performance.
Verify the specific ordering suffix 'Z' against the manufacturer's current datasheet to confirm the exact contact plating specification and material composition. Ensure the selected variant matches the required 11-position count and single-row layout for the intended PCB footprint. Cross-reference the technical drawing dimensions to confirm compatibility with the target assembly space.
Select this component when a single-row, 11-position male header with a standard 2.54 mm pitch is required. The through-hole design provides mechanical stability for board-to-board applications. Consider the gold-plated contact finish for corrosion resistance and signal integrity in general electronic environments.
This part belongs to the Fischer Elektronik MK 14 X 3 series, which offers various position counts within the same pitch and form factor family. Fischer Elektronik specializes in connectors, heat sinks, and electronic components established in Germany since 1969. This series supports diverse electronic assembly needs with standardized spacing.
Compatible substitutes include other Fischer Elektronik headers from the MK 14 X 3 series with different position counts, such as the MK 14 X 3 5 Z or MK 14 X 3 6 Z, provided the PCB footprint allows for unused holes. Ensure any alternative maintains the 2.54 mm pitch and single-row male pin configuration.
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