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MMBZ5230B-7 is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is DIODE ZENER 4.7V 350MW SOT23-3. Review the specifications below when checking this part for your BOM.
The MMBZ5230B-7-F is a single-channel surface mount Zener diode manufactured by Diodes Incorporated. It utilizes planar die construction and operates within a temperature range of -65°C to +150°C. The device provides a nominal Zener voltage of 4.7V with a tolerance of ±5%, ranging from 4.47V to 4.94V at a test current of 0.25mA. It dissipates up to 350mW on an FR-4 PCB, featuring a maximum Zener impedance of 19Ω at 0.25mA and a maximum reverse leakage current of 5µA at 2.0V.
Verify the specific ordering suffix against official documentation to confirm packaging quantity and carrier type. Confirm that the selected variant meets all applicable automotive or industrial qualification standards if required for the intended application environment. Ensure compliance with relevant environmental directives before procurement.
Select this component based on the required 4.7V nominal breakdown voltage and 350mW power dissipation capability. Consider the SOT23 package dimensions for board space constraints. Evaluate thermal resistance characteristics relative to the expected ambient operating conditions and PCB layout to ensure safe operation within the specified junction temperature limits.
This part belongs to the MMBZ5221B through MMBZ5259B series of 350mW surface mount Zener diodes. The series offers a wide range of standard Zener voltages from 2.4V to 39V. All devices share identical mechanical data, including the SOT23 package and lead-free plating specifications, differing primarily in their electrical characteristics such as breakdown voltage and impedance.
Direct replacements include other MMBZ5230B variants with different packaging suffixes, such as MMBZ5230BQ-7-F or MMBZ5230B-13-F. Cross-brand equivalents must match the 4.7V nominal voltage, 350mW power rating, and SOT23 footprint while verifying electrical parameter compatibility.
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