MMSZ5259BS-7

Single Zener Diodes Overview

The MMSZ5259BS-7-F is a surface mount Zener diode manufactured by Diodes Incorporated, housed in an SOD-323 package. It features a nominal Zener voltage of 39 V with a tolerance range of 37.05 V to 40.95 V at a test current of 3.2 mA. The device supports a maximum power dissipation of 200 mW and operates within a temperature range of -65 °C to +150 °C. Electrical characteristics include a maximum Zener impedance of 80 Ω and a maximum reverse leakage current of 0.1 µA at 30 V.

Single Zener Diodes Feature Summary

• Planar die construction for general-purpose applications
• Totally lead-free and fully RoHS compliant
• Halogen and antimony free green device

Single Zener Diodes Applications

• Voltage regulation circuits
• Overvoltage protection
• Reference voltage generation

Single Zener Diodes Procurement Notes

Verify the specific ordering suffix against manufacturer documentation to confirm packaging details. Confirm that the component meets required environmental standards such as RoHS compliance and halogen-free specifications before procurement. Ensure compatibility with automated assembly processes if applicable.

Single Zener Diodes Selection Notes

Select this component based on the required 39 V Zener voltage and 200 mW power dissipation limits. Consider the SOD-323 package dimensions for PCB layout constraints. Evaluate thermal resistance and operating temperature range requirements for the intended application environment.

Single Zener Diodes Part Context

This part belongs to the MMSZ5221BS-MMSZ5259BS series of surface mount Zener diodes from Diodes Incorporated. The series offers various voltage options in a small surface mount package suitable for automated assembly. These devices are designed for general-purpose voltage regulation and protection applications.

Single Zener Diodes Replacement Considerations

Consult official datasheets for equivalent parts from other manufacturers. Verify matching electrical parameters including Zener voltage, power dissipation, and package type. Ensure compatibility with existing PCB footprints and assembly processes.