MPC8555VTALF

Microprocessors Overview

The MPC8555VTALF is a PowerQUICC III integrated communications processor featuring an embedded e500 Book E-compatible core. It includes a 256-Kbyte L2 cache/SRAM, dual three-speed Ethernet controllers (TSEC), and a high-performance RISC Communications Processor Module (CPM). The device supports DDR SDRAM with ECC, PCI interfaces, and an advanced Security Engine for IPSec and SSL/TLS processing.

Microprocessors Feature Summary

• Integrated security engine supporting RSA, AES, DES, and SHA algorithms
• Dual three-speed Ethernet controllers with jumbo frame support
• High-performance CPM handling serial protocols and virtual DMA
• On-chip memory configurable as L2 cache or SRAM with ECC

Microprocessors Applications

• Enterprise networking equipment
• Telecom transmission and switching systems
• 3G wireless infrastructure
• Storage applications requiring parity acceleration

Microprocessors Procurement Notes

Verify the specific speed grade suffix against the datasheet to confirm operating frequency and voltage requirements. Ensure the package type matches the target PCB footprint. Confirm RoHS compliance status if required by the end product specifications.

Microprocessors Selection Notes

Select this component for applications requiring high-throughput packet processing and robust security features. Consider the available on-chip memory configuration options for caching versus persistent storage needs. Evaluate thermal management requirements based on the maximum power dissipation at the target clock speed.

Microprocessors Part Context

This processor belongs to the PowerQUICC III family, designed for communications processing using the Power Architecture technology. It combines system-level support for industry-standard interfaces with embedded processor capabilities suitable for demanding network environments.

Microprocessors Replacement Considerations

Check for MPC8555E variants with different speed grades or package options. Verify compatibility with existing software drivers and hardware designs when substituting.