MS109/TR12

Single Diodes Overview

The MS109/TR12 is a Schottky barrier rectifier manufactured by Microsemi Corporation, housed in the DO-204AL (DO-41) axial leaded package. It features a maximum repetitive peak reverse voltage of 90 V and an average forward rectified current rating of 1 A. The device utilizes Schottky technology to provide low forward voltage drop characteristics suitable for high-efficiency power conversion applications.

Single Diodes Feature Summary

• Schottky barrier construction for low forward voltage drop
• Axial through-hole mounting configuration
• High surge current capability

Single Diodes Applications

• General purpose rectification in power supplies
• Free-wheeling diodes in DC-DC converters
• Polarity protection circuits

Single Diodes Procurement Notes

Verify component authenticity as this part is listed as obsolete. Confirm manufacturing origin and lot traceability upon receipt. Check for RoHS compliance status as historical batches may vary. Ensure storage conditions meet moisture sensitivity requirements if applicable. Validate pin compatibility with existing PCB footprints before integration.

Single Diodes Selection Notes

Select this component when a low-cost, high-current axial rectifier is required. Consider the 90 V reverse voltage limit for circuit design. Evaluate thermal management needs based on the 1 A continuous current rating. Compare forward voltage specifications against alternative Schottky diodes for efficiency optimization.

Single Diodes Part Context

This component belongs to Microsemi's standard discrete diode portfolio. It serves as a reliable solution for general-purpose rectification tasks. The DO-204AL package offers robust mechanical stability for through-hole assembly processes commonly used in industrial and consumer electronics manufacturing.

Single Diodes Replacement Considerations

Consult official Microsemi documentation for direct cross-reference equivalents. Verify electrical parameters such as reverse voltage and forward current match application requirements. Ensure package dimensions and pin configurations are compatible with existing board layouts.