MSR622AJE288-12

Memory IC Overview

The MSR622AJE288-12 is a synchronous Rambus Direct RAM (RLDRAM) memory integrated circuit manufactured by MoSys, Inc. It provides a total storage capacity of 576 Mbit, organized as 32 Megawords by 18 bits. The device features a parallel interface with a maximum access time of 3.2 nanoseconds, ensuring high-speed data throughput for demanding applications. It is housed in a 288-ball Flip Chip Ball Grid Array (FCBGA) package measuring 19x19 mm, designed for surface-mount assembly on printed circuit boards.

Memory IC Feature Summary

• Supports RLDRAM architecture for high-bandwidth parallel data transfer
• Integrated 576 Mbit density within a compact FCBGA footprint
• Optimized for low-latency signal integrity in dense electronic systems

Memory IC Applications

• High-performance networking equipment requiring rapid packet buffering
• Telecommunications infrastructure utilizing fast memory access
• Industrial control systems needing deterministic data retrieval speeds

Memory IC Procurement Notes

Verify the specific suffix '12' against official manufacturer documentation to confirm the exact speed grade and operational frequency specifications. Ensure compatibility with existing PCB layouts supporting the 288-ball FCBGA form factor. Cross-reference electrical requirements with system power delivery capabilities before integration.

Memory IC Selection Notes

Select this component when system design requires the specific 576 Mbit capacity and 3.2 ns performance profile defined by the RLDRAM standard. Evaluate thermal management solutions suitable for the FCBGA package type. Confirm that the host controller supports the required parallel interface protocols and voltage levels specified in the technical datasheet.

Memory IC Part Context

MoSys, Inc. specialized in Rambus-based memory solutions, particularly RLDRAM technology, prior to its acquisition by Micron Technology. This part belongs to the MSR series, which was engineered to meet the rigorous bandwidth and latency demands of next-generation communication hardware during its production lifecycle.

Memory IC Replacement Considerations

Consult official substitution guides from Micron Technology or authorized distributors for verified equivalents. Generic SRAM replacements may not support the specific RLDRAM signaling requirements or timing constraints necessary for proper system operation.