MSR630AGC-1512

Memory IC Overview

The MoSys MSR630AGC-1512 is a Bandwidth Engine (BE3) Accelerator Engine featuring 1 Gb of high-speed memory with a 2.7 ns tRC access time. It provides up to 640 Gbps throughput via a high-speed serial interface and supports optional In-Memory Functions such as BURST for sequential data movement and RMW for compute operations. The device includes an RTL memory controller that offers a parallel QDR-like interface, simplifying integration into FPGA systems.

Memory IC Feature Summary

• Integrates optional In-Memory Functions including BURST and RMW to accelerate data processing directly within the memory array.
• Features a high-speed serial GCI interface that significantly reduces pin count while maintaining high bandwidth and signal integrity.
• Includes a supplied RTL memory controller that abstracts the serial interface, providing a standard parallel SRAM-like user interface.

Memory IC Applications

• Network search and firewall applications requiring high bandwidth data access
• FPGA acceleration for Xilinx and Intel platforms
• Real-time statistics and traffic monitoring systems

Memory IC Procurement Notes

Verify the specific suffix 'GC' against official MoSys documentation to confirm package type and temperature range. Ensure compatibility with the required RTL controller version for your target FPGA architecture. Confirm lead times and availability directly with authorized distributors or MoSys sales representatives prior to ordering.

Memory IC Selection Notes

Select this component when system design requires replacing multiple traditional QDR or SyncSRAM devices with a single high-capacity unit. It is suitable for applications needing low latency and high bandwidth where reducing board space and I/O pin complexity is critical. Consider the optional In-Memory Functions if sequential data movement or simple arithmetic operations can be offloaded from the processor.

Memory IC Part Context

The MSR630AGC-1512 belongs to the BLAZAR family of Accelerator Engines, specifically the Bandwidth Engine (BE3) series. This family is designed to solve memory bottleneck challenges in applications like AI, genomics, and security by combining high-density memory with embedded computing capabilities.

Memory IC Replacement Considerations

The datasheet notes pin compatibility with the MSP230 (QPR8). Designers should verify electrical specifications and functional equivalence before substituting other memory types, as the BE3 architecture differs fundamentally from standard SRAM or DRAM.