MSR820AJE288-12

Memory IC Overview

The MSR820AJE288-12 is a high-performance SRAM-based FPGA from the MoSys SmartFusion family, designed for customizable system-on-chip (cSoC) applications. It integrates a hard ARM Cortex-M3 microcontroller subsystem with up to 512 Kbytes of embedded nonvolatile flash memory and up to 64 Kbytes of embedded SRAM. The device features a multi-layer AHB communications matrix providing up to 16 Gbps of on-chip bandwidth and includes a 10/100 Ethernet MAC with RMII interface. It operates within a temperature range of -40 °C to +100 °C and utilizes a 288-pin FBGA package.

Memory IC Feature Summary

• Integrates a hard 100 MHz 32-bit ARM Cortex-M3 processor with zero wait state memory access and hardware divide capabilities.
• Provides substantial embedded memory resources including up to 512 Kbytes of eNVM and 64 Kbytes of eSRAM for code and data storage.
• Features a multi-layer AHB communications matrix enabling high-bandwidth data transfer and multi-master schemes.
• Includes an integrated 10/100 Ethernet MAC with RMII interface for direct network connectivity.

Memory IC Applications

• Industrial automation controllers requiring deterministic real-time processing
• Embedded systems with integrated networking requirements
• Customizable logic designs needing combined MCU and FPGA capabilities
• Applications requiring secure boot and code protection via embedded flash

Memory IC Procurement Notes

Verify the specific suffix JE288 corresponds to the required 288-pin FBGA package configuration. Confirm the operating temperature grade matches your environmental constraints, as industrial variants support extended ranges. Ensure design compatibility with the SmartFusion development tools and verify that the selected memory capacities meet your system's storage needs before finalizing procurement.

Memory IC Selection Notes

Select this component when a unified solution combining programmable logic, a hardened microcontroller, and embedded memory is required. Consider the 16 Gbps internal bandwidth if your design involves high-throughput data movement between peripherals and processors. Evaluate the pin count and package size against your PCB layout constraints, ensuring sufficient I/O availability for your peripheral connections.

Memory IC Part Context

This part belongs to the Microsemi (now Microchip) SmartFusion cSoC family, which merges FPGA fabric with ARM Cortex-M3 cores. It targets applications demanding low power consumption, small form factors, and high reliability. The family is known for its security features and ability to reduce bill-of-materials by integrating multiple discrete components into a single chip.

Memory IC Replacement Considerations

Direct replacements may include other parts within the SmartFusion family with different memory sizes or pin counts, such as the MSR820 series variants. Cross-family migration to newer Microchip PolarFire or IGLOO2 devices may require significant architectural redesign due to differences in architecture and toolchains.