MT29F2G08ABDHC-ET:D TR

Memory IC Overview

The Micron MT29F2G08ABDHC-ET:D TR is a 2 Gbit SLC NAND flash memory device organized as 256 Meg x 8. It features an asynchronous parallel interface and operates within a voltage range of 2.7 V to 3.6 V. The component supports a maximum active read current of 35 mA and functions reliably across an industrial temperature range of -40°C to +85°C. It is housed in a 63-pin VFBGA package.

Memory IC Feature Summary

• High-density storage architecture utilizing Single-Level Cell technology for reliable data retention
• Asynchronous parallel interface designed for straightforward integration into embedded systems
• Industrial-grade thermal stability ensuring consistent performance in demanding environments

Memory IC Applications

• Embedded storage solutions for industrial control systems
• Data logging modules requiring high endurance
• Consumer electronics with extended operating temperature requirements

Memory IC Procurement Notes

Verify the specific suffix 'ET:D' against official Micron documentation to confirm exact timing and environmental specifications. Ensure compatibility with the host controller's voltage levels and pin configuration before procurement. Confirm that the reel packaging meets handling requirements for the 63-VFBGA form factor.

Memory IC Selection Notes

Select this component when a parallel interface is required for cost-effective high-volume production. The 256M x 8 organization suits applications needing moderate capacity with standard I/O widths. Consider the VFBGA package size constraints and the asynchronous access times relative to system clock speeds during design.

Memory IC Part Context

This part belongs to the Micron MT29F series of SLC NAND flash memories, which are engineered for robustness and longevity. The series is widely adopted in industrial and consumer sectors where data integrity and wide temperature operation are critical. The specific model variant defines the package type and operational grade.

Memory IC Replacement Considerations

Direct replacements must match the 256M x 8 organization, parallel interface, and 63-VFBGA package. Verify that substitute parts support the same 2.7V to 3.6V supply range and industrial temperature ratings to maintain system reliability without hardware redesign.