Memory IC MT29F2T08CUHBBM4-3R:B TR product image

MT29F2T08CUHBBM4-3R:B TR

$177.35
  • Description:IC FLASH 2TBIT PARALLEL 333MHZ
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:2239563b001a Category: Brand:

  
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MT29F2T08CUHBBM4-3R:B TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 2TBIT PARALLEL 333MHZ. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT29F2T08CUHBBM4-3R:B TR

  • Description:IC FLASH 2TBIT PARALLEL 333MHZ
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND
  • Memory Size:2Tbit
  • Memory Organization:256G x 8
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.5V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT29F2T08CUHBBM4-3R:B TR

MT29F2T08CUHBBM4-3R:B TR

Memory IC Overview

The Micron MT29F2T08CUHBBM4-3R:B TR is a NAND flash memory component within the MT29F series. It features a storage capacity of 2 Tbit organized as 256 G x 8 with an 8-bit data bus width. The device utilizes TLC technology and operates at a supply voltage between 2.6V and 3.6V. It supports asynchronous parallel interfaces and functions within a commercial temperature range of 0°C to +70°C. The unit is housed in a 132-LBGA package measuring 12x18 mm, designed for surface mount applications.

Memory IC Feature Summary

  • High-density 2 Tbit storage utilizing Triple-Level Cell (TLC) architecture for efficient data retention.
  • Asynchronous parallel interface supporting standard NAND command sets for broad system compatibility.
  • Robust physical construction in a compact 132-pin LBGA package suitable for space-constrained designs.

Memory IC Applications

  • Embedded storage solutions for mobile devices
  • Solid-state drive (SSD) modules
  • Consumer electronics firmware storage

Memory IC Procurement Notes

Verify current lifecycle status as this part may be subject to discontinuation or obsolescence. Confirm exact ordering suffixes match required specifications. Check RoHS compliance details before integration. Ensure supply chain availability aligns with production schedules due to potential end-of-life constraints.

Memory IC Selection Notes

Select this component for applications requiring high density and cost-effective storage. Ensure the host system supports asynchronous NAND protocols. Verify thermal management capabilities for the 0°C to +70°C operating range. Compare pinout compatibility with existing PCB layouts using the 132-LBGA footprint.

Memory IC Part Context

This part belongs to the Micron MT29F family of NAND flash memories. It represents a generation of high-capacity storage devices designed to replace older lower-density alternatives. The series focuses on balancing performance, power efficiency, and form factor for modern embedded systems.

Memory IC Replacement Considerations

Consult official Micron documentation for qualified alternates. Verify electrical and mechanical compatibility before substitution. No specific public substitute part numbers are confirmed for direct replacement without engineering validation.

MT29F2T08CUHBBM4-3R:B TRMT29F2T08CUHBBM4-3R:B TR
$177.35
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