MT29TZZZ5D6JKFRL-107 W.96R

Memory IC Overview

The MT29TZZZ5D6JKFRL-107 W.96R is a multichip package (MCP) memory component manufactured by Micron Technology Inc. It integrates MLC NAND flash and LPDDR3 SDRAM into a single unit, providing a total storage capacity of 144 Gbit. The device utilizes BGA packaging for surface mount technology (SMD/SMT) installation. It operates within a commercial temperature range of -25°C to +85°C. This all-in-one solution combines non-volatile and volatile memory functions to support complex embedded applications requiring high-density data storage and fast processing capabilities.

Memory IC Feature Summary

• Integrates MLC NAND flash and LPDDR3 SDRAM in a single multichip package
• Provides combined non-volatile and volatile memory functionality
• Designed for surface mount technology (SMD/SMT) assembly
• Operates within a specified commercial temperature range

Memory IC Applications

• Embedded mobile devices requiring compact memory solutions
• Portable consumer electronics with mixed memory needs
• Industrial control systems utilizing embedded storage
• Automotive infotainment and telematics units

Memory IC Procurement Notes

Verify the exact part number suffix against official Micron documentation to ensure correct pinout and electrical specifications. Confirm current product status as some listings indicate obsolete or end-of-life conditions. Request manufacturer datasheets to validate operating temperatures and interface compatibility before integration. Ensure supply chain sources provide authentic components with traceable lot codes to prevent counterfeit risks in critical embedded designs.

Memory IC Selection Notes

Select this component when system architecture demands a unified memory solution combining persistent storage and working memory in a small footprint. Evaluate thermal management requirements against the -25°C to +85°C operating range. Compare physical dimensions and pin configurations with existing PCB layouts. Consider power consumption profiles of both MLC NAND and LPDDR3 interfaces during active and standby states to meet system energy efficiency targets.

Memory IC Part Context

This part belongs to Micron's MT29T series of multichip packages designed for embedded applications. These MCPs typically combine different memory technologies to reduce board space and simplify design complexity. The specific model integrates MLC NAND for data retention and LPDDR3 for high-speed data access, catering to markets needing robust performance in constrained physical environments.

Memory IC Replacement Considerations

Check for direct substitutes within the MT29T family that offer compatible pinouts and capacities. Verify if newer revisions from Micron maintain backward compatibility with existing firmware and hardware interfaces. Assess alternative vendors offering similar MLC NAND/LPDDR3 combinations if supply constraints exist.