MT30AZZZCDA0TKQS-031 W.20V TR

Memory IC Overview

The Micron MT30AZZZCDA0TKQS-031 W.20V TR is a Universal Flash Storage (UFS) based Multi-Chip Package (uMCP). It integrates TLC NAND flash memory with LPDDR5 DRAM within a single TFBGA-297 package. The component operates at an I/O voltage of 1.2 volts and supports the UFS 3.1 protocol. It is designed for high-performance mobile applications requiring combined storage and processing capabilities.

Memory IC Feature Summary

• Integrates TLC NAND flash and LPDDR5 DRAM in a single package
• Supports UFS 3.1 interface protocol
• Utilizes TFBGA-297 form factor

Memory IC Applications

• Smartphones
• Tablets
• Mobile computing devices

Memory IC Procurement Notes

Verify the specific suffix 'W.20V' against official Micron documentation to confirm lead time and availability status, as this variant may differ from standard production runs. Confirm RoHS compliance and REACH registration details directly with the manufacturer or authorized distributors before procurement.

Memory IC Selection Notes

Select this component when a compact solution combining high-speed UFS 3.1 storage with LPDDR5 memory is required. Ensure the design accommodates the TFBGA-297 footprint and 1.2V I/O requirements. Verify thermal management needs for the integrated NAND and DRAM components under maximum load conditions.

Memory IC Part Context

This part belongs to Micron's uMCP family, which consolidates multiple memory technologies into a single small form-factor package. It targets the mobile market where space efficiency and performance are critical. The integration of LPDDR5 and TLC NAND allows for reduced board area compared to discrete solutions.

Memory IC Replacement Considerations

Check Micron's official obsolescence notices. Potential substitutes include other uMCP variants with similar capacity and interface speeds, but pin compatibility and electrical specifications must be verified.