Memory IC MT41J256M8HX-187E:D product image

MT41J256M8HX-187E:D

  • Description:IC DRAM 2GBIT PAR 78FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:43a146f21849 Category: Brand:

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MT41J256M8HX-187E:D is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 2GBIT PAR 78FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT41J256M8HX-187E:D

  • Description:IC DRAM 2GBIT PAR 78FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:Parallel
  • Clock Frequency:533 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.425V ~ 1.575V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-TFBGA
  • Supplier Device Package:78-FBGA (9x11.5)
  • Access Time:13.125 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT41J256M8HX-187E:D

MT41J256M8HX-187E:D

Memory IC Overview

The MT41J256M8HX-187E:D is a Micron DDR3 SDRAM component with a 2 Gbit capacity organized as 256 Meg x 8 across eight internal banks. It operates at a nominal voltage of 1.5V and utilizes a 78-ball FBGA package measuring 9mm by 11.5mm. The -187E speed grade supports a data rate of 1066 MT/s with a cycle time of 1.87ns, featuring a CAS latency of 7. It functions within a commercial temperature range of 0°C to +95°C.

Memory IC Feature Summary

  • Supports differential bidirectional data strobes and differential clock inputs for signal integrity
  • Features dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Includes write leveling and multipurpose register capabilities for system calibration

Memory IC Applications

  • High-performance computing systems requiring standard DDR3 memory interfaces
  • Graphics processing units utilizing parallel DRAM architectures
  • Consumer electronics devices operating within commercial temperature ranges

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's current catalog to confirm availability and exact configuration options. Ensure the procurement documentation matches the required speed grade and package dimensions. Confirm that the component meets all necessary environmental compliance standards for the intended deployment region.

Memory IC Selection Notes

Select this part when a 1066 MT/s data rate with CL=7 timing is required for 2Gb capacity designs. The HX package variant provides a 9mm x 11.5mm footprint suitable for space-constrained layouts. Ensure the system design accommodates the 1.5V power supply requirements and supports the specified commercial temperature operating range.

Memory IC Part Context

This component belongs to the Micron MT41J256M8 family of DDR3 SDRAMs. The family includes variants with different configurations such as x4 and x16 densities. The HX designation specifically identifies the 78-ball FBGA package with 9mm x 11.5mm dimensions, distinguishing it from other package options in the series.

Memory IC Replacement Considerations

Compatible substitutes include the MT41J256M8HX-15E:D for slower 1333 MT/s applications and the MT41J256M8HX-125:D for faster 1600 MT/s operations. All variants share the same 78-ball FBGA package and electrical interface specifications.

MT41J256M8HX-187E:DMT41J256M8HX-187E:D

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