Memory IC MT46V32M8P-6TL:GTR product image

MT46V32M8P-6TL:GTR

$7.00
  • Description:IC DRAM 256MBIT PAR 66TSOP
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:3e4bed13d261 Category: Brand:

  
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MT46V32M8P-6TL:GTR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 256MBIT PAR 66TSOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT46V32M8P-6TL:GTR

  • Description:IC DRAM 256MBIT PAR 66TSOP
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:Parallel
  • Clock Frequency:167 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:2.3V ~ 2.7V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:66-TSSOP (0.400", 10.16mm Width)
  • Supplier Device Package:66-TSOP
  • Access Time:700 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT46V32M8P-6TL:GTR

MT46V32M8P-6TL:GTR

Memory IC Overview

The MT46V32M8P-6TL:GTR is a 256Mb DDR SDRAM component manufactured by Micron Technology. It features an 8 Meg x 8 configuration with four internal banks and operates at a clock rate of 133 MHz (PC2700). The device utilizes a 66-pin TSOP package and supports a cycle time of 6ns at CAS latency 2.5. It includes bidirectional data strobes, differential clock inputs, and programmable burst lengths of 2, 4, or 8.

Memory IC Feature Summary

  • Internal pipelined double-data-rate architecture enabling two data accesses per clock cycle
  • Source-synchronous data capture using bidirectional data strobes transmitted with data
  • Four internal banks allowing for concurrent operation to maximize effective bandwidth
  • Differential clock inputs registered on the positive edge for command entry

Memory IC Applications

  • Mobile devices requiring high-speed memory interfaces
  • Consumer electronics utilizing standard DDR SDRAM architectures
  • Industrial systems compatible with commercial temperature ranges

Memory IC Procurement Notes

Verify the specific speed grade and package type against system requirements before procurement. Confirm that the lead-free designation matches environmental compliance standards. Ensure the ordering suffix corresponds to the correct revision and temperature rating for the intended application environment.

Memory IC Selection Notes

Select this component when a 256Mb density with an 8-bit width is required. The 66-pin TSOP package is suitable for applications where board space allows for through-hole or surface mount thin profiles. Verify compatibility with SSTL_2 I/O standards and ensure the controller supports the specified CAS latencies and burst lengths.

Memory IC Part Context

This part belongs to the Micron 256Mb DDR SDRAM family, which also includes x4 and x16 configurations. The series is designed for general-purpose high-speed memory applications. The P suffix indicates a lead-free plastic TSOP package, while the G suffix denotes the specific die revision for the x8 configuration.

Memory IC Replacement Considerations

Compatible substitutes include other Micron parts within the same 256Mb DDR family, such as the MT46V32M8TG-6T or MT46V32M8BG-6, provided the package and timing parameters match.

MT46V32M8P-6TL:GTRMT46V32M8P-6TL:GTR
$7.00
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