MT47H64M16HR-3 AAT:H

Memory IC Overview

The MT47H64M16HR-3 AAT:H is a Micron DDR2 SDRAM with a 1 Gbit capacity organized as 64 Meg x 16. It operates at a maximum clock frequency of 333 MHz (DDR2-667) and supports a cycle time of 3.0 ns. The device uses an 84-ball FBGA package measuring 8 mm by 12.5 mm. Power requirements include VDD and VDDQ at +1.8V ±0.1V, with operating temperatures ranging from -40°C to +105°C.

Memory IC Feature Summary

• Features eight internal banks for concurrent operations and a 4n-bit prefetch architecture.
• Supports differential data strobes (DQS, DQS#) and on-die termination (ODT).
• Includes programmable CAS latency, posted additive latency, and adjustable drive strength.
• Complies with JEDEC standards for SSTL_18 I/O and clock jitter specifications.

Memory IC Applications

• High-performance computing systems requiring high bandwidth memory.
• Graphics processing units utilizing parallel data access.
• Industrial control equipment operating in extended temperature ranges.
• Automotive infotainment and advanced driver-assistance systems.

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required system timing constraints. Confirm that the automotive temperature rating aligns with the target application environment. Ensure the 84-ball FBGA footprint corresponds exactly to the PCB layout design. Check RoHS compliance status against current regulatory requirements before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 16-bit interface width is necessary for system memory architecture. Consider the 333 MHz speed grade if lower power consumption is prioritized over higher throughput. Evaluate the thermal performance capabilities within the intended enclosure space. Verify compatibility with existing controller logic supporting DDR2 protocols and SSTL_18 signaling levels.

Memory IC Part Context

This part belongs to the Micron MT47H series of 1Gb DDR2 SDRAM devices. It shares architectural similarities with other variants in the family but differs in organization and package type. The HR suffix indicates a lead-free 84-ball FBGA package suitable for surface mount applications. It represents a mature technology node within Micron's dynamic random-access memory portfolio.

Memory IC Replacement Considerations

Direct replacements must match the 64 Meg x 16 organization and 84-ball FBGA package dimensions. Speed grades must meet or exceed the 3.0 ns cycle time requirement. Automotive temperature ratings are mandatory for equivalent environmental durability. Verify pin-to-pin compatibility with the original design to ensure seamless integration without board modifications.