MT49H32M18CBM-18:B

Memory IC Overview

The Micron MT49H32M18CBM-18:B is a Reduced Latency DRAM (RLDRAM) IC with a total capacity of 576Mb, organized as 32 Meg x 18. It operates at a clock frequency of 533 MHz and features an access time of 15 ns. The device utilizes a 144-pin µBGA package measuring 18.5x11 mm. Power supply requirements include VDD/VDDQ voltages ranging from 1.7V to 1.95V and VEXT at 2.5V.

Memory IC Feature Summary

• Supports high-speed DDR operation with up to 533 MHz clock frequency for optimized data bandwidth
• Features non-multiplexed addresses and cyclic bank addressing for fast random access
• Includes programmable READ latency and data mask signals for write command control

Memory IC Applications

• High bandwidth communication data storage
• Telecommunications networking equipment
• Cache applications in embedded systems

Memory IC Procurement Notes

Verify the specific suffix 'CBM' against official Micron documentation to confirm voltage levels and I/O standards. Confirm RoHS compliance status and lead times directly with authorized distributors or the manufacturer. Ensure the 144-pin µBGA footprint matches the target PCB design specifications before ordering.

Memory IC Selection Notes

Select this component when designing systems requiring low-latency memory access without row/column address multiplexing overhead. It is suitable for applications demanding high sequential burst performance and balanced read/write latencies. Compare against other RLDRAM II variants based on required organization width and operating temperature ranges.

Memory IC Part Context

This part belongs to the Micron MT49H series of Reduced Latency DRAMs. It shares architectural similarities with other devices in the family, such as the MT49H32M18BM-18, but differs in specific electrical characteristics and packaging options defined by its unique suffix code.

Memory IC Replacement Considerations

Direct substitutes within the same family include the MT49H32M18BM-18:B. Verify pin compatibility and electrical parameters before swapping components.