Memory IC MT53B768M64D8BV-062 WT ES:B product image

MT53B768M64D8BV-062 WT ES:B

  • Description:IC DRAM 48GBIT 1.6GHZ FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:3d0f0415dc68 Category: Brand:

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MT53B768M64D8BV-062 WT ES:B is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 48GBIT 1.6GHZ FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT53B768M64D8BV-062 WT ES:B

  • Description:IC DRAM 48GBIT 1.6GHZ FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4
  • Memory Size:48Gbit
  • Memory Organization:768M x 64
  • Memory Interface:-
  • Clock Frequency:1.6 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.1V
  • Operating Temperature:-30°C ~ 85°C (TC)
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT53B768M64D8BV-062 WT ES:B

MT53B768M64D8BV-062 WT ES:B

Memory IC Overview

The MT53B768M64D8BV-062 WT ES:B is a mobile LPDDR4 SDRAM component manufactured by Micron Technology. It features a total storage capacity of 48 Gbit, organized as 768 Megabits by 64 bits. The device supports a maximum clock frequency of 1.6 GHz and operates with a maximum supply voltage of 1.1 V. It utilizes an FBGA package configuration suitable for surface mount technology applications.

Memory IC Feature Summary

  • Mobile LPDDR4 architecture optimized for low power consumption
  • High-density 48 Gbit memory organization
  • Surface mount compatible FBGA packaging

Memory IC Applications

  • Embedded mobile systems
  • Memory-intensive computing devices
  • Networking equipment requiring high-density storage

Memory IC Procurement Notes

Verify the specific suffix 'WT ES:B' against official Micron documentation to confirm exact manufacturing lot or revision details. Confirm RoHS compliance status and lead-free characteristics through authorized distributors. Ensure compatibility with system board design specifications regarding the FBGA footprint and thermal requirements before procurement.

Memory IC Selection Notes

Select this component when a 48 Gbit density is required within a mobile LPDDR4 form factor. The 64-bit data bus width suits high-bandwidth interfaces. Verify that the 1.6 GHz speed grade meets system timing constraints. Ensure the operating temperature range aligns with the target application environment.

Memory IC Part Context

This part belongs to the Micron MT53B series of mobile DRAM components. It represents a high-capacity solution within the LPDDR4 family, designed to replace older generations in space-constrained mobile and embedded designs where power efficiency and density are critical performance factors.

Memory IC Replacement Considerations

Consult Micron datasheets for direct pin-compatible alternatives within the MT53B series. Verify if higher speed grades such as the MT53E variant are functionally interchangeable based on system clock capabilities.

MT53B768M64D8BV-062 WT ES:BMT53B768M64D8BV-062 WT ES:B

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