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MTZJ11SB is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE ZENER 10.78V 500MW DO34. Review the specifications below when checking this part for your BOM.
The MTZJ11SB R0G is a single-die, hermetically sealed glass Zener diode manufactured by Taiwan Semiconductor. It operates within the MTZJ2V0SA to MTZJ56S series and provides a nominal Zener voltage of 10.78 V with a 2% tolerance at a test current of 5 mA. The device features a maximum power dissipation of 500 mW and a junction temperature range from -55 °C to +175 °C. Packaged in the DO-34 through-hole format with pure tin-plated leads, it exhibits a regular impedance of 30 Ω and a leakage current of 200 nA at 8 V.
Verify the specific ordering suffix (R0G) against the manufacturer's official documentation to confirm packaging details. Confirm RoHS compliance status directly with the supplier. Ensure the component meets the required thermal and electrical specifications for the intended circuit environment before finalizing procurement.
Select this component when a precise 10.78 V reference is required in a through-hole design. The DO-34 package suits standard PCB layouts. Evaluate the 500 mW power dissipation limit against expected operating currents. Consider the 2% voltage tolerance for precision requirements. Verify lead solderability per J-STD-002 standards.
This part belongs to the MTZJ2V0SA–MTZJ56S series, covering a wide Zener voltage range from 2 V to 56 V. All devices in this family share identical mechanical data, including the DO-34 case and pure tin-plated leads. The series is designed for general-purpose regulation and reference applications across various industrial and consumer electronics sectors.
Substitute parts must match the 10.78 V nominal voltage, 500 mW power rating, and DO-34 package dimensions. Verify equivalent leakage current and impedance characteristics. Ensure the replacement maintains hermetic sealing and RoHS compliance if required by the assembly process.
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