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MX7225KEWG+T is listed in the Digital To Analog Converters range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC DAC 8BIT V-OUT 24SOIC. Review the specifications below when checking this part for your BOM.
The MX7225KEWG+T is a quad, 8-bit digital-to-analog converter (DAC) manufactured by Analog Devices Inc./Maxim Integrated. It features an R-2R resistor ladder architecture with integrated voltage-output amplifier latches for buffered analog signals. The device utilizes a parallel interface for data input and operates on dual power supplies: negative supply at -5 V and positive supply ranging from 11.4 V to 16.5 V. Key performance metrics include a settling time of 4 µs, differential nonlinearity (DNL) of ±1 LSB, and integral nonlinearity (INL) of ±0.5 LSB. It is housed in a 24-pin SOIC package and supports surface-mount installation.
Verify the specific suffix 'KEWG+T' against official manufacturer documentation to confirm tape-and-reel packaging and lead-free status. Cross-reference the part number with current Analog Devices catalogs as availability may vary. Ensure the ordering information matches the required package type and environmental compliance standards before procurement.
Select this component when a quad-channel, 8-bit resolution DAC with buffered outputs is required. Verify that the parallel interface aligns with the system's digital bus capabilities. Confirm that the operating temperature range and supply voltage requirements fit within the specified limits of 11.4 V to 16.5 V for the positive rail.
This part belongs to the MX7225 family of high-speed, quad 8-bit DACs. It shares architectural similarities with the MX7226 but differs in pinout and package options. The series is designed for applications needing multiple synchronized analog outputs with moderate precision and speed.
MX7226KCWG+T offers similar functionality but may differ in pin configuration. MX7225KCWG+ is the tube-packaged equivalent. Verify compatibility regarding interface timing and physical footprint before substitution.
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