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N74F273AN,602 is listed in the Flip Flops range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC FF D-TYPE SNGL 8BIT 20DIP. Review the specifications below when checking this part for your BOM.
The N74F273AN,602 is a high-speed Schottky logic component manufactured by NXP USA Inc. It functions as an octal D-type flip-flop with three-state outputs, housed in a 20-pin DIP package. The device operates within a supply voltage range of 4.5V to 5.5V and supports a data rate of up to 100MHz. It features low input capacitance and is designed for applications requiring fast clocking and reliable data storage in digital systems.
Verify the specific suffix '602' against current NXP documentation to confirm packaging and tape-and-reel specifications. Check RoHS compliance status and lead times through authorized distributors. Confirm availability as this series may have legacy status or obsolescence notices. Ensure the 20-DIP package matches your PCB footprint requirements before ordering.
Select this component when designing systems requiring multiple synchronized data latches with bus-compatible outputs. Compare propagation delay specifications against system clock speeds to ensure timing margins are met. Consider power consumption differences compared to standard TTL or LS families if battery life is a constraint. Verify that the 5V operating voltage aligns with the rest of the system logic levels.
This part belongs to the 74F (Fast) logic family, known for superior speed-performance-power product compared to earlier generations. It serves as a digital storage element within complex integrated circuit designs. The N74F273 variant specifically provides octal configuration suitable for wide data buses. It complements other 74F series components like decoders and multiplexers in complete logic solutions.
Direct pin-compatible substitutes include the SN74F273 from Texas Instruments or the MC74F273 from ON Semiconductor. Verify electrical characteristics such as output drive strength and propagation delay match original design requirements. Ensure replacement packages support the same mounting style and thermal dissipation needs.
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