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NTS0102GD,125 is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC TRANSLTR BIDIRECTIONAL 8XSON. Review the specifications below when checking this part for your BOM.
The NTS0102GD,125 is a dual-supply translating transceiver with open-drain outputs and auto direction sensing. It features two 2-bit input-output ports (An and Bn) and an output enable input (OE). Supply voltage VCC(A) operates between 1.65 V and 3.6 V, while VCC(B) operates between 2.3 V and 5.5 V. The device supports maximum data rates of 50 Mbit/s in push-pull mode. It includes IOFF circuitry for partial power-down applications to prevent backflow current. ESD protection exceeds 2500 V HBM for the A port and 8000 V HBM for the B port. Latch-up performance exceeds 100 mA per JESD 78B Class II. It is specified for ambient temperatures from -40 °C to +125 °C.
Verify the ordering part number NTS0102GD,125 matches the required XSON8 package variant SOT996-2. Confirm that the temperature range specification aligns with the design requirement of -40 °C to +125 °C. Ensure the PCB layout accommodates the specific dimensions of the GD package, noting the absence of a center pad compared to the TL replacement option.
Select this component when interfacing systems operating at different supply voltages, specifically where VCC(A) ranges from 1.65 V to 3.6 V and VCC(B) ranges from 2.3 V to 5.5 V. It is suitable for point-to-point applications using open-drain drivers. For push-pull driver applications, verify if the NTB0102 might be more appropriate based on specific system requirements.
The NTS0102GD,125 belongs to the NTS0102 family of dual supply translating transceivers manufactured by NXP Semiconductors. This family provides bidirectional voltage level translation capabilities with auto direction sensing. The GD variant utilizes an XSON8 package (SOT996-2), distinguishing it from other package options like TSSOP8 or standard XSON8 within the same product line.
The NTS0102TLH is a drop-in replacement for the NTS0102GD. The TL package includes a center pad not electrically connected to silicon, whereas the GD package lacks this pad. Evaluate PCB layout risks regarding traces under the center pad area before substituting.
The device incorporates IOFF circuitry that disables the outputs when either VCC(A) or VCC(B) is powered down. This prevents damaging backflow current through the device during partial power-down applications.
The primary difference is that the TL package has a center pad which is not electrically connected to the silicon, while the GD package does not have a center pad. Both packages share similar pin configurations and electrical characteristics.
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