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OPA2705EA/250 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC CMOS 2 CIRCUIT 8VSSOP. Review the specifications below when checking this part for your BOM.
The OPA2705EA/250 is a dual-channel, low-cost CMOS operational amplifier manufactured by Texas Instruments. It features rail-to-rail input and output capabilities, supporting single-supply operation from 4 V to 12 V or dual supplies of ±2 V to ±6 V. Key electrical specifications include a gain-bandwidth product of 1 MHz, a slew rate of 600 mV/µs, and an input bias current of 10 pA. The device operates with a quiescent current of 160 µA per channel and provides an output current of 10 mA. It is housed in an 8-pin VSSOP package and functions within a temperature range of -40°C to +85°C.
Verify the specific suffix /250 indicates reel packaging configuration when ordering. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure ESD handling protocols are followed due to the CMOS input structure. Cross-reference the datasheet for moisture sensitivity level requirements during storage and assembly processes.
Select this component for designs requiring rail-to-rail performance at low cost. Compare against JFET-input amplifiers if lower input bias current is critical. Consider the 1 MHz bandwidth limit for high-speed applications. Evaluate thermal dissipation in dense PCB layouts given the small VSSOP footprint.
This part belongs to the OPA2705 series, which includes variants like OPA2705UA (SOIC-8) and OPA2703EA/250G4. The family focuses on low-power, general-purpose amplification with rail-to-rail I/O. The EA/250 designation specifically denotes the VSSOP-8 package variant optimized for surface-mount assembly.
OPA2705UA offers identical electrical characteristics in an SOIC-8 package. OPA2703EA/250G4 is a quad-channel variant with similar performance metrics. Verify pin compatibility and thermal resistance differences when substituting packages.
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