Instrumentation, Op Amps, Buffer Amps OPA358AIDCKT product image

OPA358AIDCKT

$1.31
  • Description:IC OPAMP GP 1 CIRCUIT SC70-6
  • Series:-
  • Mfr:Texas Instruments
  • Package:Tape & Reel (TR),Cut Tape (CT),Bulk

SKU:df9b9e8f8166 Category: Brand:

  
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OPA358AIDCKT is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP GP 1 CIRCUIT SC70-6. Review the specifications below when checking this part for your BOM.

Instrumentation, Op Amps, Buffer Amps specifications for OPA358AIDCKT

  • Description:IC OPAMP GP 1 CIRCUIT SC70-6
  • Series:-
  • Mfr:Texas Instruments
  • Package:Tape & Reel (TR),Cut Tape (CT),Bulk
  • Amplifier Type:General Purpose
  • Number of Circuits:1
  • Output Type:Rail-to-Rail
  • Slew Rate:55V/µs
  • Gain Bandwidth Product:80 MHz
  • Current - Input Bias:0.3 pA
  • Voltage - Input Offset:2 mV
  • Current - Supply:5.2mA
  • Current - Output / Channel:50 mA
  • Voltage - Supply Span (Min):2.5 V
  • Voltage - Supply Span (Max):3.6 V
  • Operating Temperature:-40°C ~ 85°C
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:6-TSSOP, SC-88, SOT-363
  • Supplier Device Package:SC-70-6
  • -3db Bandwidth:-

Instrumentation, Op Amps, Buffer Amps datasheet and documents for OPA358AIDCKT

OPA358AIDCKT

Instrumentation, Op Amps, Buffer Amps Overview

The OPA358AIDCKT is a single-channel high-speed operational amplifier manufactured by Texas Instruments. It operates on a single supply voltage ranging from 2.7 V to 3.3 V and features an 80 MHz gain-bandwidth product with a slew rate of 55 V/us. The device delivers a voltage gain of 92 dB, a common-mode rejection ratio of 80 dB, and an output current capability of 50 mA per channel. Input characteristics include a bias current of 50 pA, offset voltage of 2 mV, and input noise density of 6.4 nV/sqrt Hz. It consumes 5.2 mA of operating current and supports rail-to-rail input and output. The component is housed in a SC-70-6 package and functions within a temperature range of -40 C to +85 C.

Instrumentation, Op Amps, Buffer Amps Feature Summary

  • High-speed performance with 80 MHz bandwidth and 55 V/us slew rate for rapid signal processing
  • Rail-to-rail input and output capabilities enabling full dynamic range operation on single supplies
  • Low power consumption of 5.2 mA suitable for battery-operated applications
  • Compact SC-70-6 surface-mount packaging for space-constrained designs

Instrumentation, Op Amps, Buffer Amps Applications

  • Portable medical instrumentation requiring high speed and low power
  • Video buffering and signal conditioning in consumer electronics
  • Data acquisition systems utilizing single-supply architectures
  • Communication equipment interface circuits

Instrumentation, Op Amps, Buffer Amps Procurement Notes

Verify the specific suffix IDCKT corresponds to the SC-70-6 package and tape-and-reel or cut-tape availability as listed. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure the operating voltage range aligns with your system's 2.7 V to 3.3 V supply constraints. Check for any recent production lifecycle notices regarding obsolescence or pin-compatible replacements.

Instrumentation, Op Amps, Buffer Amps Selection Notes

Select this component when high bandwidth and fast transient response are critical alongside low power consumption. The rail-to-rail I/O feature simplifies design in single-supply environments by maximizing signal swing. Consider the 50 mA output drive if driving moderate capacitive loads or transmission lines. Compare against lower-speed op-amps if bandwidth requirements exceed 80 MHz or if higher precision offset voltages are necessary.

Instrumentation, Op Amps, Buffer Amps Part Context

This part belongs to the OPA358 series of high-speed operational amplifiers from Texas Instruments. It is designed for applications demanding both speed and efficiency in compact form factors. The SC-70-6 package variant offers a small footprint compared to larger SOIC or MSOP options, facilitating dense PCB layouts in modern portable devices.

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