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OPA358AIDCKT is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP GP 1 CIRCUIT SC70-6. Review the specifications below when checking this part for your BOM.
The OPA358AIDCKT is a single-channel high-speed operational amplifier manufactured by Texas Instruments. It operates on a single supply voltage ranging from 2.7 V to 3.3 V and features an 80 MHz gain-bandwidth product with a slew rate of 55 V/us. The device delivers a voltage gain of 92 dB, a common-mode rejection ratio of 80 dB, and an output current capability of 50 mA per channel. Input characteristics include a bias current of 50 pA, offset voltage of 2 mV, and input noise density of 6.4 nV/sqrt Hz. It consumes 5.2 mA of operating current and supports rail-to-rail input and output. The component is housed in a SC-70-6 package and functions within a temperature range of -40 C to +85 C.
Verify the specific suffix IDCKT corresponds to the SC-70-6 package and tape-and-reel or cut-tape availability as listed. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure the operating voltage range aligns with your system's 2.7 V to 3.3 V supply constraints. Check for any recent production lifecycle notices regarding obsolescence or pin-compatible replacements.
Select this component when high bandwidth and fast transient response are critical alongside low power consumption. The rail-to-rail I/O feature simplifies design in single-supply environments by maximizing signal swing. Consider the 50 mA output drive if driving moderate capacitive loads or transmission lines. Compare against lower-speed op-amps if bandwidth requirements exceed 80 MHz or if higher precision offset voltages are necessary.
This part belongs to the OPA358 series of high-speed operational amplifiers from Texas Instruments. It is designed for applications demanding both speed and efficiency in compact form factors. The SC-70-6 package variant offers a small footprint compared to larger SOIC or MSOP options, facilitating dense PCB layouts in modern portable devices.
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