PCF2123U/12HA/1,00

$0.38

Description：IC RTC CLOCK/CALENDAR SPI DIE
Series：-

SKU:67fa9fc70fed Category: Real Time Clocks Brand: NXP USA Inc.

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Product introduction

PCF2123U/12HA/1,00 is listed in the Real Time Clock range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC RTC CLOCK/CALENDAR SPI DIE. Review the specifications below when checking this part for your BOM.

Real Time Clock specifications for PCF2123U/12HA/1,00

Description：IC RTC CLOCK/CALENDAR SPI DIE
Series：-
Package：Bulk
Mfr：NXP USA Inc.
Type：Clock/Calendar
Features：Alarm, Leap Year, Square Wave Output, Watchdog Timer
Memory Size：-
Time Format：HH:MM:SS (12/24 hr)
Date Format：YY-MM-DD-dd
Interface：SPI
Voltage - Supply：1.6V ~ 5.5V
Voltage - Supply, Battery：-
Current - Timekeeping (Max)：0.33µA ~ 0.38µA @ 2V ~ 5V
Operating Temperature：-40°C ~ 85°C
Mounting Type：-
Grade：-
Qualification：-
Package / Case：Die
Supplier Device Package：Die

Real Time Clock datasheet and documents for PCF2123U/12HA/1,00

PCF2123U/12HA/1,00

Real Time Clock Overview

The PCF2123U/12HA/1,00 is a CMOS Real-Time Clock (RTC) and calendar provided as a wafer-level chip size package (WLCSP12). It operates via a Serial Peripheral Interface (SPI-bus) with a maximum data rate of 6.25 Mbit/s. The device provides year, month, day, weekday, hours, minutes, and seconds based on a 32.768 kHz quartz crystal. Key electrical parameters include a clock operating voltage range of 1.1 V to 5.5 V and a typical backup current of 100 nA at VDD = 2.0 V and Tamb = 25 °C. It features an integrated oscillator with load capacitors for CL = 7 pF, programmable offset registers for frequency adjustment, and open-drain interrupt and clock output pins.

Real Time Clock Feature Summary

SPI interface with up to 6.25 Mbit/s data rate
Low backup current: typical 100 nA at 2.0 V
Integrated 32.768 kHz oscillator with 7 pF load capacitors
Programmable alarm and timer functions with interrupt capability

Real Time Clock Applications

Time keeping applications
Battery powered devices
Metering
High duration timers
Daily alarms

Real Time Clock Procurement Notes

Verify the specific ordering suffix /1,00 corresponds to the sawn 6 inch wafer on plastic Film Frame Carrier (FFC) for 8 inch wafer configuration as listed in the NXP datasheet. Confirm that the WLCSP12 package variant matches the required PCB footprint and assembly capabilities for bare die or wafer-level packaging integration.

Real Time Clock Selection Notes

Select this component when an SPI interface is preferred over I2C for higher speed communication. Ensure the design supports the 1.1 V to 5.5 V supply range. Consider the WLCSP12 package constraints for board space and thermal management. Verify compatibility with the 32.768 kHz external quartz crystal requirements for the integrated oscillator circuit.

Real Time Clock Part Context

The PCF2123 series includes various packages such as HVQFN16 (PCF2123BS), TSSOP14 (PCF2123TS), and wire bond dies. The PCF2123U/12HA/1,00 specifically denotes the WLCSP12 wafer level chip size package variant. Other variants like PCF2123TS/1,118 offer surface mount solutions in different form factors while maintaining identical core RTC functionality.