PLS83-X3 REL.1.1

RF Transceiver Modules And Modems Overview

The Telit Cinterion PLS83-X3 REL.1.1 is a global LTE Cat.4 MTE module supporting 18 LTE bands, eight 3G UMTS/WCDMA bands, and dual-band GSM/GPRS/EDGE. It features integrated GNSS with GPS, GLONASS, Galileo, and BeiDou support. The module provides high-speed connectivity with up to 150 Mbps downlink and 50 Mbps uplink speeds. It includes USB 2.0, UART, I2C, and SPI interfaces for versatile integration.

RF Transceiver Modules And Modems Feature Summary

• Supports global LTE Cat.4 connectivity across 18 bands
• Integrated multi-constellation GNSS receiver
• Dual-band 3G and GSM/EDGE legacy support
• Multiple digital interfaces including USB and UART

RF Transceiver Modules And Modems Applications

• Global IoT asset tracking devices
• Connected vehicle telematics systems
• Industrial machine monitoring solutions
• Smart metering infrastructure

RF Transceiver Modules And Modems Procurement Notes

Verify the specific revision level (REL.1.1) against current manufacturer documentation to ensure compatibility with existing firmware and regulatory certifications. Confirm interface pinouts and power supply requirements match the target application design before procurement.

RF Transceiver Modules And Modems Selection Notes

Select this module when global LTE coverage with legacy 3G fallback is required. Ensure the host system supports the necessary USB or UART interfaces. Verify that the antenna design accommodates the module's RF performance specifications across all supported frequency bands.

RF Transceiver Modules And Modems Part Context

This part belongs to the Telit Cinterion PLS83 series of LTE modules designed for IoT applications. It represents an evolution in global connectivity options, offering comprehensive band support for worldwide deployment while maintaining backward compatibility with older network technologies.

RF Transceiver Modules And Modems Replacement Considerations

Check for newer revisions such as REL.1.2 or REL.2.1 if available. Ensure any substitute maintains identical form factor and pinout compatibility for direct replacement without PCB redesign.