PSF 21150 H V1.4

Telecom Overview

The PSF 21150 H V1.4 is an ISDN PC adapter circuit from the IPAC-X series by Infineon Technologies, designed for wired communications. It operates on a single 3.3V supply with a typical current consumption of 30mA. The device supports an operating temperature range of -40°C to 85°C and features a 64-pin P-MQFP package. It integrates one circuit dedicated to handling ISDN protocols, providing essential interface capabilities for terminal equipment.

Telecom Feature Summary

• Supports S/T-interface layer 1 state machines for TE, LT-T, LT-S, and NT modes
• Includes HDLC controllers for D-channel and B-channel data processing
• Provides IOM-2 interface handler with controller data access and monitor channel support

Telecom Applications

• ISDN PC Adapter Card for S Interface
• ISDN Voice/Data Terminal
• ISDN Stand-Alone Terminal with POTS Interface

Telecom Procurement Notes

Verify component authenticity through official manufacturer channels or authorized distributors. Confirm that the specific revision matches project requirements, as datasheet details may vary between versions. Check RoHS compliance status against local environmental regulations before integration into final assemblies.

Telecom Selection Notes

Select this component when designing ISDN terminals requiring integrated Layer 1 control and HDLC processing. Ensure the design accommodates the 64-pin P-MQFP footprint and provides adequate thermal management for the specified operating temperature range. Verify power supply stability for the 3.3V requirement.

Telecom Part Context

This part belongs to the IPAC-X family of ISDN interface circuits. It serves as a specialized telecommunications IC intended for connecting personal computers and other digital terminals to Integrated Services Digital Network infrastructure via standard S/T interfaces.

Telecom Replacement Considerations

The PSF 21150 F V1.4 is a documented variant within the same product line, differing primarily in package type (TQFP vs MQFP). Verify pinout compatibility and mechanical constraints before substituting.