RM222-060-202-2900

Headers, Receptacles, Female Sockets Overview

The AirBorn RM222-060-202-2900 is a rectangular MIL Spec connector from the R Series, manufactured by Molex. It is a board mount receptacle featuring a vertical orientation and a plastic body. The component supports dual rows with a 0.075-inch (1.91 mm) pitch. Termination is achieved via through-hole soldering. The connector utilizes female socket contacts and is designed for secure mounting on printed circuit boards.

Headers, Receptacles, Female Sockets Feature Summary

• Dual row configuration for high-density interconnect applications
• Through-hole termination method for reliable PCB mounting
• Vertical installation style with straight orientation

Headers, Receptacles, Female Sockets Applications

• Military electronic systems requiring MIL-DTL-55302 compliance
• Aerospace avionics control panels
• Ruggedized industrial equipment interfaces

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific manufacturer part number against official Molex/AirBorn documentation to ensure compatibility with existing system designs. Confirm that the through-hole termination and vertical orientation match the target PCB layout requirements before procurement.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a dual-row, vertical receptacle with a 1.91 mm pitch is required for MIL Spec applications. Ensure the design accommodates the through-hole footprint and verify that the female socket contact type aligns with the mating header specifications.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the AirBorn R Series of rectangular connectors, which are widely used in demanding environments. As a Molex company product, it adheres to strict military standards, providing robust performance in aerospace and defense sectors where reliability is critical.

Headers, Receptacles, Female Sockets Replacement Considerations

Cross-reference with other MIL-DTL-55302 compliant parts if availability is an issue. Verify mechanical dimensions and electrical ratings to ensure functional equivalence without modifying the host system architecture.