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RM332-047-121-2900 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is RM332-047-121-2900. Review the specifications below when checking this part for your BOM.
The RM332-047-121-2900 is a rectangular MIL-Spec connector from the AirBorn R Series, manufactured by Molex. It complies with MIL-DTL-55302 standards and features a 47-position configuration across three rows. The component utilizes a straight through-hole termination style for board mounting. Contact surfaces are gold-plated beryllium copper sockets housed in a polyphenylene sulfide (PPS) body. Electrical ratings include a current capacity of 3 A and a voltage rating of 750 V. The unit operates within a temperature range of -65 C to +125 C and maintains a contact pitch of 1.91 mm.
Verify the specific termination alloy and plating thickness against the official datasheet before integration. Confirm that the straight orientation matches the PCB layout requirements. Ensure compatibility with mating plugs within the same R Series family to maintain seal integrity and mechanical alignment during assembly processes.
Select this model for applications requiring high-density interconnects in harsh environments. The three-row layout maximizes pin count within standard footprints. Verify that the 3 A current rating per contact meets circuit load demands. Consider the straight form factor for direct panel or board insertion where right-angle routing is unnecessary.
This part belongs to the AirBorn R Series, a line of rectangular connectors designed for high-reliability applications. The series is characterized by its compliance with strict military standards and robust construction materials. The RM332 prefix indicates a receptacle configuration with specific row and position counts defined by the manufacturer's coding system.
Compatible substitutes must match the MIL-DTL-55302 specification, 47-position count, and 3-row layout. Verify identical pinout arrangements and physical dimensions to ensure interchangeability without redesigning the host chassis or PCB.
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