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RM632-252-521-9000 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is RM632-252-521-9000. Review the specifications below when checking this part for your BOM.
The AirBorn RM632-252-521-9000 is a rectangular MIL-DTL-55302 compliant board mount plug from the R Series. It features a plastic body with 252 positions arranged in six rows and a 1.91 mm pitch. The connector utilizes gold-plated beryllium copper male pins for reliable signal transmission. Designed for through-hole termination, it offers a straight mounting angle and operates within a temperature range of -65°C to +125°C. The unit provides robust environmental sealing and mechanical stability for demanding applications.
Verify the specific ordering suffix against the official Molex AirBorn datasheet to confirm contact plating thickness, guide pin configuration, and termination style. Ensure the selected variant matches the required environmental sealing and mechanical retention specifications for the target application environment.
Select this component when a high-density, MIL-specification interconnect is required for board-to-board or cable-to-board connections. Consider the 1.91 mm pitch and six-row layout for space-constrained designs needing extensive signal routing. Validate that the through-hole mounting style aligns with the PCB fabrication capabilities and thermal profile requirements.
This part belongs to the AirBorn R Series, a family of rectangular connectors designed for harsh environments. The series is characterized by its modular design, allowing for various row counts and contact arrangements. As a Molex company product, it adheres to strict quality standards and offers comprehensive support for defense and aerospace sectors requiring certified components.
Cross-reference with other MIL-DTL-55302 compliant manufacturers such as Glenair or Amphenol SV Microwave. Verify that any substitute maintains identical mating dimensions, contact current ratings, and environmental sealing characteristics to ensure system compatibility.
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