RSP-206358-2-2-0533

Overview

The RSP-206358-2-2-0533 is a flexible board stacking header manufactured by Samtec Inc. It features a 2.00 mm pitch and is designed for surface mount assembly. The component utilizes a flexible interconnect technology to accommodate misalignment between stacked printed circuit boards. This specific part number corresponds to a configuration within the standard flexible header series, providing reliable electrical connections in compact vertical stacking applications.

Feature Summary

• Flexible interconnect design accommodates board-to-board misalignment
• Surface mount termination for automated assembly
• 2.00 mm pitch spacing for compact layouts

Applications

• Vertical board stacking in electronic assemblies
• Compact multi-layer PCB interconnections
• Applications requiring tolerance for alignment errors

Procurement Notes

Verify the exact pin count and stack height against the official Samtec datasheet or CAD model before finalizing the design. Confirm that the mating socket selection matches the header's specific configuration. Ensure compliance with RoHS and REACH requirements if mandated by the end product specifications. Cross-reference the part number carefully to avoid ordering incorrect stack heights.

Selection Notes

Select this component when flexible board-to-board connections are required in space-constrained environments. Consider the available stack heights and pin counts offered in the TW series family. Evaluate the need for mating sockets such as the SQW or TLE series. Verify that the surface mount footprint aligns with the PCB layout constraints and manufacturing capabilities.

Part Context

This part belongs to Samtec's flexible board stacking header family, characterized by 2.00 mm pitch and flexible contact technology. These headers are engineered to provide robust connections while absorbing mechanical stress from misaligned boards. The series offers various configurations to suit different vertical spacing requirements in modern electronics.

FAQ

Is this component suitable for high-frequency signal transmission?

The component is primarily designed for general interconnection and board stacking. For high-frequency applications, consult Samtec’s Signal Integrity Group for models optimized for EM field solvers and signal performance.

What is the moisture sensitivity level of this connector?

According to environmental compliance data for this series, the moisture sensitivity level is classified as Level 1, indicating it is not sensitive to moisture during handling.