Memory IC S25FL256SAGNFI010 product image

S25FL256SAGNFI010

$4.32
  • Description:IC FLASH 256MBIT SPI/QUAD 8WSON
  • Series:FL-S
  • Mfr:Infineon Technologies
  • Package:Tray,Tray

SKU:bf000d82bd8b Category: Brand:

  
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S25FL256SAGNFI010 is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC FLASH 256MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S25FL256SAGNFI010

  • Description:IC FLASH 256MBIT SPI/QUAD 8WSON
  • Series:FL-S
  • Mfr:Infineon Technologies
  • Package:Tray,Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for S25FL256SAGNFI010

S25FL256SAGNFI010

Memory IC Overview

The S25FL256SAGNFI010 is a 256 Mbit NOR flash memory device manufactured by Infineon Technologies. It utilizes the MirrorBit technology and Eclipse architecture to deliver high performance through a Quad SPI interface with support for Double Data Rate (DDR) commands. The device operates within a supply voltage range of 2.7 V to 3.6 V and supports clock frequencies up to 133 MHz. It features a 32 M x 8 organization and is housed in an 8-WSON package. The component is designed for applications requiring code execution directly from memory.

Memory IC Feature Summary

  • Supports Multi-I/O commands including Single, Dual, and Quad I/O modes over the SPI interface.
  • Enables In-System Programming (ISP) and In-Application Programming (IAP) capabilities.
  • Features hardware-based error correction codes (ECC) for data integrity protection.

Memory IC Applications

  • Code Execution in Place (XIP) for embedded systems
  • Storage of firmware and boot code
  • Data storage in industrial control systems

Memory IC Procurement Notes

Verify the specific suffix '010' against official Infineon documentation to confirm the exact package type and temperature grade. Ensure compatibility with existing PCB footprints for the 8-WSON configuration. Confirm that the required DDR command support aligns with the host controller's interface capabilities before finalizing procurement.

Memory IC Selection Notes

Select this component when a compact footprint is required alongside high-speed data transfer rates. The 8-WSON package offers space efficiency compared to larger SOIC options. Consider the 133 MHz maximum clock speed for bandwidth-intensive applications. Verify that the operating temperature range meets the environmental requirements of the target deployment scenario.

Memory IC Part Context

This part belongs to the S25FL256S series, which represents a generation of high-density NOR flash memories. The series integrates advanced MirrorBit technology to achieve higher density within standard packages. It maintains pinout compatibility with previous generations to facilitate design upgrades while offering improved performance metrics.

Memory IC Replacement Considerations

Check for direct substitutes within the S25FL256S family that may offer different packaging options such as WSON or SOIC. Verify if alternative suffixes provide the same electrical characteristics but with different thermal ratings or package dimensions.

S25FL256SAGNFI010S25FL256SAGNFI010
$4.32
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