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SBT55LAFC_R1_00001 is listed in the Single Diodes range at ChipApex. The manufacturer field lists Panjit International Inc.. Its product description is DIODE SCHOTTKY 50V 5A SMAFC. Review the specifications below when checking this part for your BOM.
The SBT55LAFC_R1_00001 is a Schottky barrier rectifier manufactured by Panjit International Inc. It features a 50V repetitive peak reverse voltage and a 5A average forward rectified current capability. The device utilizes the SMAF-C (DO-221AC) surface-mount package, designed for efficient thermal dissipation and compact board space utilization. Key electrical characteristics include a maximum DC blocking voltage of 50V and a high surge current rating of 80A. The component operates within a junction temperature range of -55°C to +150°C, ensuring reliability in demanding power conversion environments.
Verify the specific suffix R1_00001 against the manufacturer's official datasheet to confirm packaging details such as reel size or tape specifications. Ensure that the SMAF-C footprint matches the design requirements. Cross-reference the part number with authorized distributors to confirm authenticity and traceability before finalizing procurement orders.
Select this component when a low forward voltage drop is critical for efficiency in 50V applications. The SMAF-C package is suitable for designs requiring robust thermal management in a small form factor. Compare the 80A surge rating against expected inrush currents to ensure adequate safety margins during startup conditions.
This part belongs to Panjit's portfolio of Schottky diodes, which are engineered for high-efficiency power management. The SSB series typically targets general-purpose rectification where speed and low loss are prioritized over high voltage blocking capabilities. It serves as a discrete solution for modern electronic systems requiring reliable power conversion.
Consult official substitution lists for equivalent SMAF-C packaged Schottky diodes with matching 50V and 5A ratings. Verify pin compatibility and thermal resistance values before integrating alternative components into existing designs.
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