SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Bopla SC1230NG is a polycarbonate enclosure designed for industrial applications. It features a translucent grey housing with a black lid, providing visual access to internal components while maintaining structural integrity. The unit measures 300 mm in length, 125 mm in width, and 230 mm in height. It includes integrated mounting points and cable entry options suitable for DIN rail or panel installation. The design emphasizes durability against environmental factors such as dust and moisture.
Verify the specific part number suffixes against official Bopla documentation to ensure correct material properties and accessory inclusion. Confirm dimensional tolerances and mounting hole patterns match your mechanical design requirements before ordering. Check for any regional regulatory compliance markings required for your target market.
Select this model when visual status indication of internal components is necessary alongside standard environmental protection. Consider the polycarbonate material's resistance to UV radiation and impact if deployed in outdoor or high-traffic areas. Ensure adequate clearance for cable entries and heat dissipation based on the enclosed device's power consumption.
This enclosure belongs to Bopla's series of compact industrial housings. It is engineered for modular expansion and integration into larger control systems. The design prioritizes ease of assembly and maintenance while adhering to strict industrial safety standards.
Consult official Bopla cross-reference lists for direct replacements. Verify that alternative models maintain identical mounting dimensions and ingress protection ratings to ensure seamless integration without modifying existing infrastructure.
The enclosure is manufactured from polycarbonate, offering high impact resistance and translucency.
Yes, the design includes provisions for DIN rail mounting as well as panel or surface installation.
Wilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More