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SGTL5000XNLA3R2 is listed in the Codecs range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC AUDIO CODEC STEREO 20-QFN. Review the specifications below when checking this part for your BOM.
The SGTL5000XNLA3R2 is a low-power stereo audio codec with an integrated headphone amplifier, manufactured by NXP Semiconductors. It provides a comprehensive audio solution for portable products requiring line-in, mic-in, line-out, headphone-out, and digital I/O. The device operates within a supply voltage range of 1.62 V to 3.6 V and supports sampling frequencies from 8 kHz to 96 kHz. Key performance metrics include an ADC SNR of 85 dB at 1.8 V and 90 dB at 3.3 V, alongside a DAC SNR of 100 dB. It features a capless headphone design, programmable microphone gain, and integrated digital audio processing capabilities such as surround sound and bass enhancement.
Verify the specific ordering suffix R2 indicates tape-and-reel packaging when sourcing components. Confirm the package type corresponds to the 20-pin sawn QFN variant specified for this part number. Ensure compatibility with the required operating temperature range of -40°C to +85°C for the intended application environment.
Select the SGTL5000XNLA3R2 for designs prioritizing ultra-low power consumption in portable electronics. This 20-pin QFN package is suitable for applications with strict footprint constraints compared to the 32-pin variants. Consider the internal PLL functionality if the host processor lacks a precise audio master clock source.
This component belongs to the SGTL5000 family of low-power stereo codecs. The XNLA3R2 designation specifically identifies the 20-pin sawn QFN package version with reel packaging. It shares the same core architecture and electrical specifications as the 32-pin QFN variants, differing primarily in physical dimensions and pin count.
Public confirmed substitute part numbers are not available in the provided documentation. The SGTL5000XNAA3/R2 (32-pin) is a pin-compatible alternative but requires verification of package differences.
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